Transistor contacts and methods of forming the same
US-2024395871-A1 · Nov 28, 2024 · US
US8963258B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963258-B2 |
| Application number | US-201313800817-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 13, 2013 |
| Priority date | Mar 13, 2013 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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A FinFET includes a substrate, a fin structure on the substrate, a source in the fin structure, a drain in the fin structure, a channel in the fin structure between the source and the drain, a gate dielectric layer over the channel, and a gate over the gate dielectric layer. At least one of the source and the drain includes a bottom SiGe layer.
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What is claimed is: 1. A FinFET, comprising: a substrate having a major surface; a fin structure on the substrate, the fin extending from the major surface and having a topmost surface; a source in the fin structure, the source extending below the topmost surface of the fin; a drain in the fin structure, the drain extending below the topmost surface of the fin; a channel in the fin structure between the source and the drain; a gate dielectric layer over the channel; and…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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