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Method of creating an extremely thin semiconductor-on-insulator (ETSOI) layer having a uniform thickness
US8940554B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8940554-B2 |
| Application number | US-201213359970-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 27, 2012 |
| Priority date | Oct 22, 2009 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
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A method for creating an extremely thin semiconductor-on-insulator (ETSOI) layer having a uniform thickness includes: measuring a thickness of a semiconductor-on-insulator (SOI) layer at a plurality of locations; determining a removal thickness at each of the plurality of locations; and implanting ions at the plurality of locations. The implanting is dynamically based on the removal thickness at each of the plurality of locations. The method further includes oxidizing the SOI layer to form an oxide layer, and removing the oxide layer.
First claim
Opening claim text (preview).
What is claimed: 1. A system, comprising: a measuring device configured to measure thickness of an SOI layer at a plurality of locations; a processor configured to determine a removal thickness at each of the a plurality of locations; an ion implant device configured to implant a species into the SOI layer at each of the plurality of locations, wherein at least one of implantation dose and implantation energy are adjusted based on the removal thickness at each of the plurality…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US8940554B2 cover?
- A method for creating an extremely thin semiconductor-on-insulator (ETSOI) layer having a uniform thickness includes: measuring a thickness of a semiconductor-on-insulator (SOI) layer at a plurality of locations; determining a removal thickness at each of the plurality of locations; and implanting ions at the plurality of locations. The implanting is dynamically based on the removal thickness a…
- Who is the assignee on this patent?
- Berliner Nathaniel C, Cheng Kangguo, Furukawa Toshiharu, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10P74/23. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).