Methods for forming apparatus for stud bump formation

Patent metadata

Field	Value
Publication number	US-8936730-B2
Application number	US-201313960576-A
Country	US
Kind code	B2
Filing date	Aug 6, 2013
Priority date	Sep 6, 2012
Publication date	Jan 20, 2015
Grant date	Jan 20, 2015

Abstract

An apparatus used for forming stud bumps may be formed by providing a first clamp plate comprising a clamping surface, forming a notcher on the clamping surface, and forming a contact stopper on the clamping surface. The apparatus may include a clamp that includes at least two opposing plates, and at least one of the opposing plates includes a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire. The method for forming stud bumps includes bonding wire to a bonding surface, releasing the wire from the clamp, passing the wire a notch pitch distance through the clamp, clamping the wire with the clamp forming a second notch in the wire, and breaking the wire leaving a bonded portion of the wire on the bonding surface.

First claim

What is claimed is:

1. A method comprising:
etching a first recess in a sacrificial substrate;
forming a first clamping plate comprising a notcher, the forming comprising depositing a material on the sacrificial substrate and in the first recess, the notcher corresponding to the material in the first recess; and
removing the sacrificial substrate.

2. The method of claim 1 further comprising attaching the first clamping plate to a clamp of a wire bonder,…

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Lin Yeong-Jyh
• Liao Hsin-Hung
• Hwang Chien Ling
• Liu Chung-Shi
• Lii Mirng-Ji
• Yu Chen-Hua
• Hsiao Yi-Li

Classifications

• H10W72/07141

  Electricity · mapped topic

• B23K31/02 Primary

  Operations & Transport · mapped topic

• B23K20/007 Primary

  Operations & Transport · mapped topic

• B21D53/36

  Operations & Transport · mapped topic

• Y10T29/49

  Cross-Sectional Technologies · mapped topic