Method and Apparatus for Flexible Circuit Cable Attachment
US-2019394885-A1 · Dec 26, 2019 · US
Operations & Transport
Operations & Transport · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K20/007 |
| Official title | — |
| Display label | Operations & Transport (mapped technology topic) |
| Total patents | 111 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 19 |
| 2016 | 21 |
| 2017 | 2 |
| 2018 | 7 |
| 2019 | 11 |
| 2020 | 3 |
| 2021 | 6 |
| 2022 | 10 |
| 2023 | 8 |
| 2024 | 12 |
| 2025 | 12 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Protected chip-scale package (CSP) pad structure
US-10510606-B2 · Dec 17, 2019 · US
Method and apparatus for flexible circuit cable attachment
US-10448517-B2 · Oct 15, 2019 · US
Multiple actuator wire bonding apparatus
US-2019304947-A1 · Oct 3, 2019 · US
Wire bonding method and wire bonding apparatus
US-2019287941-A1 · Sep 19, 2019 · US
Protected chip-scale package (csp) pad structure
US-2019252257-A1 · Aug 15, 2019 · US
Method for calibrating wire clamp device, and wire bonding apparatus
US-2019237428-A1 · Aug 1, 2019 · US
Cleaning systems for wire bonding tools, wire bonding machines including such systems, and related methods
US-2019237427-A1 · Aug 1, 2019 · US
Protected chip-scale package (CSP) pad structure
US-10276441-B2 · Apr 30, 2019 · US
Wire bonding apparatus and wire bonding method
US-10262968-B2 · Apr 16, 2019 · US
Protected chip-scale package (csp) pad structure
US-2019006237-A1 · Jan 3, 2019 · US
Method and apparatus for measuring a free air ball size during wire bonding
US-10163845-B2 · Dec 25, 2018 · US
Method for forming ball in bonding wire
US-10121764-B2 · Nov 6, 2018 · US
Method for manufacturing light emitting device
US-2018240935-A1 · Aug 23, 2018 · US
Method for forming ball in bonding wire
US-2018096965-A1 · Apr 5, 2018 · US
Wire bonding apparatus and wire bonding method
US-2018090464-A1 · Mar 29, 2018 · US
Method and system for pull testing of wire bonds
US-9889521-B2 · Feb 13, 2018 · US
Off substrate kinking of bond wire
US-9893033-B2 · Feb 13, 2018 · US
Copper wire and electrode joining method and joint structure
US-9793238-B2 · Oct 17, 2017 · US
Copper wire and electrode joining method and joint structure
US-2017179075-A1 · Jun 22, 2017 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K20/007?
- CPC B23K20/007 is the Cooperative Patent Classification code for “Operations & Transport.”
- How many patents are filed under CPC B23K20/007 (Operations & Transport)?
- Our database includes 111 publications tagged with this CPC code.
- Is patent activity under CPC B23K20/007 growing?
- Publication counts under this code: 12 in 2024 vs 12 in 2025 (latest complete years).