Sample analysis apparatus and sample analysis program

US8933402B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8933402-B2
Application numberUS-201313829289-A
CountryUS
Kind codeB2
Filing dateMar 14, 2013
Priority dateMar 16, 2012
Publication dateJan 13, 2015
Grant dateJan 13, 2015

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Abstract

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A sample is analyzed efficiently with combining a structural defect detection and a physical information measurement so as to determine whether a structural defect is the defect that degrades the device performance or not, not only by detecting the structural defect exists in the sample, but also by measuring a physical information that occurs due to the structural defect. It comprises a structural defect detection device 2 that detect a structural defect KK of a sample W, a structural defect setting device that sets up the structural defect KK for which a physical information is to be measured based on the defect information among the structural defect KK detected by the structural defect detection device 2 , and a physical information measurement device 3 that measures the physical information of the defect region KR including the structural defect set up by the structural defect setting device.

First claim

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I claim: 1. A sample analysis apparatus comprising: a structural defect detection device that detects a structural defect of a sample, a structural defect setting device that sets the structural defect for which physical information is to be measured among structural defects detected by the structural defect detection device based on defect information of the structural defect, a control device configured to control a first physical information measurement device and a second…

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What does patent US8933402B2 cover?
A sample is analyzed efficiently with combining a structural defect detection and a physical information measurement so as to determine whether a structural defect is the defect that degrades the device performance or not, not only by detecting the structural defect exists in the sample, but also by measuring a physical information that occurs due to the structural defect. It comprises a struct…
Who is the assignee on this patent?
Horiba Ltd
What technology area does this patent fall under?
Primary CPC classification H10P74/23. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).