Die bonding systems, and methods of using the same

Patent metadata

Field	Value
Publication number	US-2025385216-A1
Application number	US-202519323134-A
Country	US
Kind code	A1
Filing date	Sep 9, 2025
Priority date	Nov 22, 2021
Publication date	Dec 18, 2025
Grant date	—

Abstract

A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.

First claim

What is claimed:

1 . A method of bonding a die to a substrate, the method comprising the steps of:
(a) simultaneously imaging along a first optical path (i) one of a first plurality of fiducial markings on a die while the die is carried by a bond head assembly, and (ii) one of a second plurality of fiducial markings on a substrate; (b) simultaneously imaging along a second optical path (i) another of the first plurality of fiducial markings on the die while the die is carried by the bond head assembly and (ii) another of the second plurality of fiducial markings on the substrate; (c) adjusting a relative position of the die with respect to the substrate; and (d) bonding the die to the substrate.

2 . The method of claim 1 further comprising the step of performing a coarse alignment of the die with respect to the substrate prior to each of steps (a)-(d).

3 . The method of claim 1 wherein each of steps (a) and (b) is carried out by an imaging system carried by the bond head assembly.

4 . The method of claim 1 wherein the bond head assembly includes a bond tool for holding the die during steps (a)-(d).

5 . The method of claim 4 wherein the bond tool holds the die at a holding portion of the bond tool during steps (a)-(d), the holding portion being formed from an infrared transparent material.

6 . The method of claim 1 wherein steps (a) and (b) use an infrared imaging system to perform the imaging.

7 . The method of claim 1 wherein the first optical path includes a first camera, and the second optical path includes a second camera.

8 . The method of claim 7 wherein an optical element is included in each of the first optical path and the second optical path.

9 . The method of claim 8 wherein the first camera is configured for imaging from a first position above the optical element, and the second camera is configured for imaging from a second position along a side of the optical element.

10 . The method of claim 1 wherein each of steps (a) and (b) are performed by an imaging system simultaneously.

11 . The method of claim 10 wherein the imaging system includes a camera, the camera being included in each of the first optical path and the second optical path.

12 . The method of claim 1 wherein steps (a) and (b) are performed by an imaging system including a scanning mirror, the scanning mirror being configured to alternately provide for imaging of (a) the one of the first plurality of fiducial markings and the one of the second plurality of fiducial markings along the first optical path, and (b) the another of the first plurality of fiducial markings and the another of the second plurality of fiducial markings along the second optical path.

13 . The method of claim 1 wherein each of steps (a)-(c) are repeated until an alignment detected between the die and the substrate satisfies a predetermined accuracy criteria.

14 . The method of claim 13 wherein step (d) is performed after the alignment detected between the die and the substrate satisfies the predetermined accuracy criteria.

15 . A die bonding system comprising:
a bond head assembly for bonding a die to a substrate, the die including a first plurality of fiducial markings, the substrate including a second plurality of fiducial markings; and an imaging system configured for simultaneously imaging (i) one of the first plurality of fiducial markings and (ii) one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly, the imaging system configured for simultaneously imaging (i) another of the first plurality of fiducial markings and (ii) another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly, the imaging system including a camera and a scanning mirror, the scanning mirror being configured to alternately provide for imaging of (a) the one of the first plurality of fiducial markings and the one of the second plurality of fiducial markings along the first optical path, and (b) the another of the first plurality of fiducial markings and the another of the second plurality of fiducial markings along the second optical path.

16 . The die bonding system of claim 15 wherein the imaging system is carried by the bond head assembly.

17 . The die bonding system of claim 15 wherein the bond head assembly includes a bond tool for holding the die prior to bonding the die to the substrate.

18 . The die bonding system of claim 17 wherein the bond tool holds the die at a holding portion of the bond tool, the holding portion being formed from an infrared transparent material.

19 . The die bonding system of claim 15 wherein the imaging system is an infrared imaging system.

Assignees

• Kulicke & Soffa Ind Inc

Inventors

• Marte Andreas
• Buergi Daniel
• Ernst Urban
• Kakkava Eirini
• Holzer Alexander
• Moser Mathias
• Schneider Fabian

Classifications

• H10W72/985

  Alignment aids, e.g. alignment marks · CPC title

• H10W99/00 Primary

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W90/791

  of direct-bonded pads · CPC title

• H10W80/301

  Bonding techniques, e.g. hybrid bonding · CPC title

• H10W80/211

  using auxiliary members, e.g. aids for protecting the bonding area · CPC title