Process chamber process kit with protective coating

US2025385080A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025385080-A1
Application numberUS-202519316924-A
CountryUS
Kind codeA1
Filing dateSep 2, 2025
Priority dateJun 14, 2018
Publication dateDec 18, 2025
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments described herein generally relate to a method and apparatus for fabricating a chamber component for a plasma process chamber. In one embodiment a chamber component used within a plasma processing chamber is provided that includes a metallic base material comprising a roughened non-planar first surface, wherein the roughened non-planar surface has an Ra surface roughness of between 4 micro-inches and 80 micro-inches, a planar silica coating formed over the roughened non-planar surface, wherein the planar silica coating has a surface that has an Ra surface roughness that is less than the Ra surface roughness of the roughened non-planar surface, a thickness between about 0.2 microns and about 10 microns, less than 1% porosity by volume, and contains less than 2E12 atoms/centimeters2 of aluminum.

First claim

Opening claim text (preview).

1 . A chamber component for use in a processing chamber, comprising: a base material comprising a roughened surface, wherein the roughened surface has an average surface roughness (Ra) within a range of 4 micro-inches to 80 micro-inches; and a silica coating formed over the roughened surface, wherein: the formed silica coating has a surface that has an Ra that is less than the Ra of the roughened surface, the formed silica coating a thickness within a range of 0.2 microns to 10 microns, and the formed silica coating blocks atoms from leaching from the base material and into the formed silica coating such that the surface of the formed silica coating contains less than 2E 12 atoms/centimeters 2 of a metal. 2 . The chamber component of claim 1 , wherein the base material comprises aluminum, and the metal is aluminum. 3 . The chamber component of claim 1 , wherein the metal is at least part of a composition of the base material. 4 . The chamber component of claim 1 , wherein the base material comprises a gas distribution showerhead, a nozzle assembly, or a baffle. 5 . The chamber component of claim 1 , wherein the base material comprises a liner. 6 . The chamber component of claim 5 , wherein the liner comprises a cathode liner. 7 . The chamber component of claim 1 , wherein the roughened surface is a metallic surface. 8 . The chamber component of claim 1 , wherein the surface of the formed silica coating contains more than 0 atoms/centimeters 2 of the metal. 9 . The chamber component of claim 1 , wherein the roughened surface comprises pits, and the silica coating fills in the pits. 10 . The chamber component of claim 1 , wherein the silica coating has less than 1% porosity by volume. 11 . A chamber component for use in a processing chamber, comprising: a body comprising a roughened surface, wherein the roughened surface has an average surface roughness (Ra) within a range of 4 micro-inches to 80 micro-inches; and a silica coating formed over the roughened surface, wherein: the silica coating blocks atoms from leaching from the body and into the silica coating. 12 . The chamber component of claim 11 , wherein the surface of the silica coating has an Ra that is less than the Ra of the roughened surface. 13 . The chamber component of claim 11 , wherein the body comprises a gas distribution showerhead or a nozzle assembly. 14 . The chamber component of claim 11 , wherein the body comprises a baffle. 15 . The chamber component of claim 11 , wherein the silica coating has less than 1% porosity by volume, and a surface of the silica coating contains less than 2E 12 atoms/centimeters 2 of a metal. 16 . A processing chamber, comprising: a chamber body defining a processing volume; a substrate support disposed in the processing volume; a gas inlet opening to flow a gas to the processing volume; one or more chamber components respectively comprising: a body comprising a roughened surface, wherein the roughened surface has an average surface roughness (Ra) within a range of 4 micro-inches to 80 micro-inches; and a silica coating formed over the roughened surface, wherein: the silica coating blocks atoms from leaching from the body and into the silica coating such that a surface of the silica coating contains less than 2E 12 atoms/centimeters 2 of a metal. 17 . The processing chamber of claim 16 , wherein the base material comprises aluminum, and the metal is aluminum. 18 . The processing chamber of claim 16 , wherein the metal is at least part of a composition of the base material. 19 . The processing chamber of claim 16 , wherein the surface of the silica coating has an Ra that is less than the Ra of the roughened surface. 20 . The processing chamber of claim 16 , wherein the silica coating has a thickness within a range of 0.2 microns to 10 microns, and the silica coating has less than 1% porosity by volume.

Assignees

Inventors

Classifications

  • Manufacture or treatment · CPC title

  • for drying etching · CPC title

  • Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

  • characterised by the means for protecting vessels or internal parts, e.g. coatings · CPC title

  • Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides · CPC title

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What does patent US2025385080A1 cover?
Embodiments described herein generally relate to a method and apparatus for fabricating a chamber component for a plasma process chamber. In one embodiment a chamber component used within a plasma processing chamber is provided that includes a metallic base material comprising a roughened non-planar first surface, wherein the roughened non-planar surface has an Ra surface roughness of between 4…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H01J37/32495. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Dec 18 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).