Substrate heat treatment device

Patent metadata

Field	Value
Publication number	US-2025351234-A1
Application number	US-202519040602-A
Country	US
Kind code	A1
Filing date	Jan 29, 2025
Priority date	May 10, 2024
Publication date	Nov 13, 2025
Grant date	—

Abstract

A substrate heat treatment device includes a heat treatment chamber having a heat treatment space, a gas injection unit located inside the heat treatment chamber and having a gas outlet configured to inject gas into the heat treatment chamber, and a diffusion guide positioned adjacent to the gas injection unit within the heat treatment chamber and extending along a first horizontal direction intersecting a discharge direction of the gas emitted through the gas outlet, wherein an inner surface of the diffusion guide facing the gas outlet includes a concave surface formed concavely along a second horizontal direction intersecting the first horizontal direction.

First claim

What is claimed is:

1 . A substrate heat treatment device comprising:
a heat treatment chamber having a heat treatment space; a gas injection unit located inside the heat treatment chamber and having a gas outlet configured to inject gas into the heat treatment chamber; and a diffusion guide positioned adjacent to the gas injection unit within the heat treatment chamber, wherein the diffusion guide extends along a first horizontal direction intersecting a discharge direction of the gas emitted through the gas outlet, wherein an inner surface of the diffusion guide facing the gas outlet includes a concave surface formed along a second horizontal direction intersecting the first horizontal direction.

2 . The substrate heat treatment device of claim 1 , wherein the diffusion guide includes a central line, a first wing located on one side of the central line and directed in the second horizontal direction, and a second wing located on the other side of the central line and directed in the second horizontal direction.

3 . The substrate heat treatment device of claim 2 , wherein the central line overlaps the gas outlet.

4 . The substrate heat treatment device of claim 3 , wherein the first wing and the second wing have symmetrical shapes with respect to the central line.

5 . The substrate heat treatment device of claim 2 , wherein each of the first wing and the second wing are closer to the gas injection unit as the first wing and the second wing extend away from the central line.

6 . The substrate heat treatment device of claim 5 , wherein each of the first wing and the second wing are spaced apart from the gas injection unit.

7 . The substrate heat treatment device of claim 6 , wherein a spacing disposed between the first wing and the gas injection unit and a spacing disposed between the second wing and the gas injection unit constitute a gas discharge space.

8 . The substrate heat treatment device of claim 7 , wherein the gas discharge space has a slit shape extending in the first horizontal direction.

9 . The substrate heat treatment device of claim 2 , wherein angles formed by the first wing and the second wing with respect to a vertical direction directed perpendicular to the first and second horizontal directions are each between about 70 degrees and about 89 degrees.

10 . The substrate heat treatment device of claim 1 , wherein
the gas injection unit includes a plurality of gas outlets arranged along a longitudinal direction of the gas injection unit, and the plurality of gas outlets are spaced apart from one another at intervals of about 60mm to about 75 mm.

11 . The substrate heat treatment device of claim 7 , further comprising:
a heating unit located inside the heat treatment chamber, and including a gas discharge hole connected to the gas outlet, wherein the gas injection unit is coupled to the heating unit at a position where the gas outlet and the gas discharge hole are connected.

12 . The substrate heat treatment device of claim 11 , wherein
the heating unit is arranged continuously along the first horizontal direction, the heating unit includes a heating plate including the gas discharge hole and a heat pipe coupled to the heating plate, and the gas injection unit includes a gas supply pipe coupled to the heating plate while being spaced apart from the heat pipe and overlapping the gas discharge hole.

13 . The substrate heat treatment device of claim 12 , wherein the diffusion guide is spaced apart from the heating plate with the gas discharge space disposed therebetween.

14 . The substrate heat treatment device of claim 12 , wherein the diffusion guide includes a block shape arranged continuously along a longitudinal direction of the heating plate.

15 . The substrate heat treatment device of claim 12 , further comprising:
a substrate support located inside the heat treatment chamber and positioned to face the heating unit to support a substrate to be heat-treated.

16 . The substrate heat treatment device of claim 1 , further comprising:
a gas supply unit connected to the gas injection unit to supply gas to the gas injection unit, and a gas discharge unit for discharging the gas supplied into the heat treatment chamber to the outside of the heat treatment chamber.

17 . A substrate heat treatment device comprising:
a heat treatment chamber defining a heat treatment space; a gas injection unit located inside the heat treatment chamber and including a gas outlet configured to inject gas into the heat treatment chamber; and a diffusion plate positioned adjacent to the gas injection unit within the heat treatment chamber, and located in a first horizontal direction intersecting a discharge direction of the gas emitted through the gas outlet, wherein the diffusion plate includes a guide surface configured to move the gas in a direction opposite to the discharge direction.

18 . The substrate heat treatment device of claim 17 , wherein
the diffusion plate includes a bent portion located in a central region and a pair of inclined portions extending symmetrically in both directions from the bent portion, wherein each of the pair of inclined portions include the guide surface.

19 . The substrate heat treatment device of claim 18 , wherein the pair of inclined portions each have an inclination angle of about 70 degrees to about 89 degrees with respect to a straight line directed in the discharge direction.

20 . The substrate heat treatment device of claim 17 , wherein
the gas injection unit includes a plurality of gas outlets arranged along a longitudinal direction of the gas injection unit, wherein the plurality of gas outlets are spaced apart from one another at intervals of about 60 mm to about 75 mm.

Assignees

• Samsung Display Co Ltd

Inventors

• Park Eun A
• Yoon Geon Ho

Classifications

• H10P72/0434 Primary

  mainly by convection · CPC title

• F27B2005/161

  Gas inflow or outflow · CPC title

• F27B5/16

  Arrangements of air or gas supply devices · CPC title

• F27B5/02

  of multiple-chamber type · CPC title

• H05B3/22 Primary

  non-flexible · CPC title