Substrate pad and die pillar design modifications to enable extreme fine pitch flip chip (fc) joints
US-2024113069-A1 · Apr 4, 2024 · US
Multiple bump connectors having different shapes
Multiple bump connectors having different shapes · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/237 |
| Official title | {Multiple bump connectors having different shapes} |
| Display label | Multiple bump connectors having different shapes |
| Total patents | 1,098 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 97 |
| 2016 | 93 |
| 2017 | 106 |
| 2018 | 88 |
| 2019 | 90 |
| 2020 | 109 |
| 2021 | 106 |
| 2022 | 126 |
| 2023 | 90 |
| 2024 | 93 |
| 2025 | 90 |
| 2026 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Double-sided substrate with cavities for direct die-to-die interconnect
US-2024038729-A1 · Feb 1, 2024 · US
Circuit Probing Structures and Methods for Probing the Same
US-2015380328-A1 · Dec 31, 2015 · US
P-N separation metal fill for flip chip LEDs
US-9219209-B2 · Dec 22, 2015 · US
Package on package structures and methods for forming the same
US-9219030-B2 · Dec 22, 2015 · US
Reconfigured wide i/o memory modules and package architectures using same
US-2015364454-A1 · Dec 17, 2015 · US
Circuits incorporating integrated passive devices having inductances in 3d configurations and stacked with corresponding dies
US-2015364418-A1 · Dec 17, 2015 · US
Bump Structure and Method of Forming Same
US-2015357301-A1 · Dec 10, 2015 · US
Bump-on-trace structures with high assembly yield
US-9209149-B2 · Dec 8, 2015 · US
Interconnect solder bumps for die testing
US-9207275-B2 · Dec 8, 2015 · US
Structure and method for integrated circuits packaging with increased density
US-2015348940-A1 · Dec 3, 2015 · US
Flip chip packages having chip fixing structures, electronic systems including the same, and memory cards including the same
US-2015348930-A1 · Dec 3, 2015 · US
Semiconductor Device Having Solderable and Bondable Electrical Contact Pads
US-2015333023-A1 · Nov 19, 2015 · US
Structure for microelectronic packaging with bond elements to encapsulation surface
US-2015334831-A1 · Nov 19, 2015 · US
Package structure, chip structure and fabrication method thereof
US-2015325545-A1 · Nov 12, 2015 · US
Conductive contacts having varying widths and method of manufacturing same
US-2015325542-A1 · Nov 12, 2015 · US
Interconnect pillars with directed compliance geometry
US-9184144-B2 · Nov 10, 2015 · US
Bump structure having a side recess and semiconductor structure including the same
US-2015318253-A1 · Nov 5, 2015 · US
Ultra fine pitch and spacing interconnects for substrate
US-9159670-B2 · Oct 13, 2015 · US
Circuits incorporating integrated passive devices having inductances in 3d configurations and stacked with corresponding dies
US-2015289360-A1 · Oct 8, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/237?
- CPC H10W72/237 is the Cooperative Patent Classification code for “Multiple bump connectors having different shapes.”
- How many patents are filed under CPC H10W72/237 (Multiple bump connectors having different shapes)?
- Our database includes 1,098 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/237 growing?
- Publication counts under this code: 93 in 2024 vs 90 in 2025 (latest complete years).