Processing method for boule and grinding equipment

Patent metadata

Field	Value
Publication number	US-2025222551-A1
Application number	US-202418928192-A
Country	US
Kind code	A1
Filing date	Oct 28, 2024
Priority date	Jan 10, 2024
Publication date	Jul 10, 2025
Grant date	—

Abstract

A processing method for a boule includes the following steps. The boule is moved to a first processing station of a grinding equipment, and a first grinding wheel located within the first processing station is utilized to perform a sidewall grinding process on a sidewall of the boule. During the sidewall grinding process, the boule rotates along a first rotational axis, and the first grinding wheel rotates along a second rotational axis, wherein the first rotational axis is parallel to the second rotational axis. The boule is moved to a second processing station of the grinding equipment, and a second grinding wheel located within the second processing station is utilized to perform a top surface grinding process on a top surface of the boule.

First claim

What is claimed is:

1 . A processing method for a boule, comprising:
moving the boule to a first processing station of a grinding equipment, and utilizing a first grinding wheel located within the first processing station to perform a sidewall grinding process on a sidewall of the boule, wherein during the sidewall grinding process, the boule rotates along a first rotational axis, and the first grinding wheel rotates along a second rotational axis, wherein the first rotational axis is parallel to the second rotational axis, and a direction in which the boule rotates along the first rotational axis is equal to a direction in which the first grinding wheel rotates along the second rotational axis; and moving the boule to a second processing station of the grinding equipment, and utilizing a second grinding wheel located within the second processing station to perform a top surface grinding process on a top surface of the boule, wherein during the top surface grinding process, the second grinding wheel rotates along a third rotational axis, and the boule rotates along the first rotational axis, wherein the third rotational axis is perpendicular to the first rotational axis.

2 . The processing method according to claim 1 , further comprising:
after performing the sidewall grinding process and before performing the top surface grinding process, an X-ray instrument is utilized to perform a crystal plane measurement procedure on the boule, and a processing region on the sidewall of the boule is obtained.

3 . The processing method according to claim 2 , further comprising:
after performing the sidewall grinding process, the first grinding wheel is utilized to form a flat on the processing region.

4 . The processing method according claim 2 , further comprising:
after performing the sidewall grinding process, the second grinding wheel is utilized to form a V-shaped notch on the processing region.

5 . The processing method according to claim 1 , wherein during the sidewall grinding process, the first grinding wheel moves along a z-axis, and the boule moves toward the first grinding wheel along an x-axis and/or a y-axis perpendicular to the z-axis, wherein the z-axis is parallel to the first rotational axis and the second rotational axis, and the third rotational axis is parallel to the y-axis.

6 . The processing method according to claim 1 , wherein during the top surface grinding process, the second grinding wheel moves toward the boule along a z-axis, and the boule moves along an x-axis and/or a y-axis perpendicular to the z-axis, wherein the z-axis is parallel to the first rotational axis and the second rotational axis, and the third rotational axis is parallel to the y-axis.

7 . A grinding equipment, comprising:
a movable carrier module, comprising:
a processing platform, configured to move between a first processing station and a second processing station; and
a platform rotating motor, configured to rotate the processing platform along a first rotational axis;
a first grinding module, comprising:
a first grinding wheel, located within the first processing station and configured to move up and down along a z-axis and configured to rotate along a second rotational axis, wherein the second rotational axis is parallel to the first rotational axis; and
a second grinding module, comprising:
a second grinding wheel, located within the second processing station and configured to move up and down along the z-axis and configured to rotate along a third rotational axis, wherein the third rotational axis is perpendicular to the first rotational axis.

8 . The grinding equipment according to claim 7 , wherein the first grinding module further comprises:
a first servo motor; a vertical main axis, wherein the first grinding wheel is connected to the vertical main axis, and the first servo motor is configured to rotate the first grinding wheel and the vertical main axis along the second rotational axis; and a first lifting module, configured to move the first servo motor, the vertical main axis and the first grinding wheel up and down along the z-axis.

9 . The grinding equipment according to claim 7 , wherein the movable carrier module further comprises:
a rail module, configured to move the processing platform along an x-axis perpendicular to the z-axis.

10 . The grinding equipment according to claim 7 , wherein the processing platform comprises magnets.

Assignees

• Globalwafers Co Ltd

Inventors

• Lin Ching-Shan

Classifications

• H10P90/123 Primary

  by grinding or lapping · CPC title

• H10P90/129

  by polishing · CPC title

• C30B25/00

  Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth · CPC title

• C30B1/12

  by pressure treatment during the growth · CPC title

• C30B23/00

  Single-crystal growth by condensing evaporated or sublimed materials · CPC title