Home port, substrate treating apparatus, and method for discharging chemical solution

Patent metadata

Field	Value
Publication number	US-2025091077-A1
Application number	US-202418661139-A
Country	US
Kind code	A1
Filing date	May 10, 2024
Priority date	Sep 18, 2023
Publication date	Mar 20, 2025
Grant date	—

Abstract

A home port includes: a cylindrical body including: an open upper, a lower end, and an outlet in the lower end of the cylindrical body; a cover covering the open upper end; a pipe connected to the outlet; and a first bracket between the cover and the outlet, wherein a hole is provided in the first bracket, the first bracket has an inclined surface inclined from a first side of the first bracket to a second side of the first bracket, a vertical level of the first side of the first bracket is higher than a vertical level of the second side of the first bracket, and the hole of the first bracket is provided at the second side of the first bracket.

First claim

What is claimed is:

1 . A home port comprising:
a cylindrical body comprising:
an open upper end;
a lower end; and
an outlet in the lower end of the cylindrical body;
a cover covering the open upper end; a pipe connected to the outlet; and a first bracket between the cover and the outlet, wherein a hole is provided in the first bracket, wherein the first bracket has an inclined surface inclined from a first side of the first bracket to a second side of the first bracket, wherein a vertical level of the first side of the first bracket is higher than a vertical level of the second side of the first bracket, and wherein the hole of the first bracket is provided at the second side of the first bracket.

2 . The home port of claim 1 , further comprising a second bracket between the first bracket and the outlet,
wherein a hole is provided in the second bracket.

3 . The home port of claim 2 , wherein the second bracket has an inclined surface inclined from a first side of the second bracket, to a second side of the second bracket,
wherein the first side of the second bracket overlaps the first side of the first bracket, wherein the second side of the second bracket overlaps the second side of the first bracket, wherein a vertical level of one side of the second bracket is higher than a vertical level of the second side of the second bracket, and wherein the hole of the second bracket is provided at the second side of the second bracket.

4 . The home port of claim 1 , wherein the outlet does not overlap with the hole of the first bracket.

5 . The home port of claim 1 , wherein in a plan view of the home port, an area size of the hole of the first bracket is in a range of about 10% to 15% of an area size of the first bracket.

6 . A substrate treatment apparatus comprising:
a chamber; a chemical solution supply nozzle in the chamber, wherein the chemical solution supply nozzle comprises:
a supply pipe configured to supply a chemical solution to an upper surface of a substrate; and
a nozzle tip configured to spray the chemical solution to the upper surface of the substrate;
a home port in the chamber, wherein the home port comprises an open upper end configured to receive the chemical solution discharged from the chemical solution supply nozzle; and a discharge pipe provided within the chamber and configured to discharge a residue discharged from an inner space of the home port through an outlet of the home port, wherein the home port comprises:
a cover covering the open upper end; and
a first bracket having a hole therein,
wherein a diameter of the cover is greater than a diameter of the nozzle tip, wherein the first bracket has an inclined surface inclined from a first side of the first bracket to a second side of the first bracket, wherein a vertical level of the first side of the first bracket is higher than a vertical level of the second side of the first bracket, and wherein a hole is provided at the second side of the first bracket.

7 . The substrate treatment apparatus of claim 6 , wherein the home port further comprises a second bracket between the first bracket and the outlet and having a hole therein.

8 . The substrate treatment apparatus of claim 7 , wherein the second bracket has an inclined surface extending at an incline from one side of the second bracket overlapping a first side of the first bracket to the second side thereof overlapping the second side of the first bracket such that a vertical level of a first side thereof is higher than a vertical level of the second side thereof, and
wherein the hole is provided at the second side of the second bracket.

9 . The substrate treatment apparatus of claim 7 , wherein in a plan view of the home port, an area size of the hole of the first bracket is in a range of about 10% to 15% of an area size of the first bracket, and
wherein in the plan view of the home port, an area size of the hole of the second bracket is in a range of about 10% to 15% of an area size of the second bracket.

10 . The substrate treatment apparatus of claim 6 , further comprising:
a deionized water supply pipe configured to provide deionized water to the home port; and a double discharge pipe configured to discharge the chemical solution and the deionized water.

11 . The substrate treatment apparatus of claim 10 , wherein the double discharge pipe has a T shaped structure.

12 . The substrate treatment apparatus of claim 10 , wherein the deionized water inside the home port fills an inside of the home port up to a vertical level spaced vertically upwardly by about 5 mm from a free end of the nozzle tip.

13 . The substrate treatment apparatus of claim 6 , further comprising an in-nozzle fine supply pipe in chemical solution supply the nozzle,
wherein the in-nozzle fine supply pipe is configured to provide at least one of deionized water and nitrogen (N 2 ) in a gas state to the nozzle tip.

14 . The substrate treatment apparatus of claim 6 , further comprising:
a dipping cup on a side of the home port and configured to supply a cleaning liquid to clean the nozzle tip; a cleaning liquid discharge pipe at a bottom of the dipping cup and configured to discharge the cleaning liquid out of the dipping cup; and a nitrogen injector configured to spray gaseous nitrogen (N 2 ) to the nozzle tip.

15 . The substrate treatment apparatus of claim 14 , further comprising an ultrasonic cleaner configured to apply ultrasonic vibration to the dipping cup.

16 . The substrate treatment apparatus of claim 14 , further comprising a nozzle moving unit configured to move the nozzle tip vertically and horizontally.

17 . The substrate treatment apparatus of claim 14 , wherein the cleaning liquid comprises deionized water.

18 . A method for discharging a chemical solution, the method comprising:
providing a home port comprising:
a cylindrical body comprising:
an open upper end;
a lower end; and
an outlet in the lower end;

a cover covering the open upper end;
a pipe connected to the outlet; and
a first bracket between the cover and the outlet,
wherein a hole is provided in the first bracket,
wherein the first bracket has an inclined surface inclined from a first side of the first bracket to a second side of the first bracket,
wherein a vertical level of the first side of the first bracket is higher than a vertical level of the second side of the first bracket,
wherein the hole of the first bracket is provided at the second side of the first bracket;
discharging the chemical solution from a nozzle into the cylindrical body; and discharging the discharged chemical solution to the outlet.

19 . The method of claim 18 , wherein discharging the chemical solution from the nozzle comprises:
spraying deionized water to a nozzle tip provided at an end of the nozzle; and spraying nitrogen to the nozzle tip.

20 . The method of claim 19 , wherein the spraying the nitrogen comprises spraying the nitrogen in a gas state.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kang Min Suk
• Kim Young-Hoo
• Park Sung Hyun
• You Jin Seon
• Kim Tae-Hong
• Shim Woo Gwan

Classifications

• B05B15/55

  using cleaning fluids · CPC title

• B05B14/00 Primary

  Arrangements for collecting, re-using or eliminating excess spraying material (arrangements integral with nozzles B05B1/28) · CPC title

• B05B13/0278

  Arrangement or mounting of spray heads (B05B13/0207 takes precedence) · CPC title

• B05B15/16

  for preventing non-intended contact between spray heads or nozzles and foreign bodies, e.g. nozzle guards · CPC title

• B05B15/50

  Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter · CPC title