Electrostatic chuck

US2025069933A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025069933-A1
Application numberUS-202418806123-A
CountryUS
Kind codeA1
Filing dateAug 15, 2024
Priority dateAug 21, 2023
Publication dateFeb 27, 2025
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electrostatic chuck 10 includes a dielectric substrate 100, a base plate 200, and a joining layer 300 which joins the dielectric substrate 100 and the base plate 200. The joining layer 300 is obtained by containing a plurality of particulate filler materials 320 inside resin 310. The content of the filler materials 320 in the joining layer 300 is equal to or lower than 70% by weight.

First claim

Opening claim text (preview).

What is claimed is: 1 . An electrostatic chuck comprising: a dielectric substrate; a base plate; and a joining layer which joins the dielectric substrate and the base plate, wherein the joining layer is obtained by containing a plurality of particulate filler materials inside resin, and a content of the filler materials in the joining layer is equal to or lower than 70% by weight. 2 . The electrostatic chuck according to claim 1 , wherein the resin is silicone. 3 . The electrostatic chuck according to claim 1 , wherein the filler materials contain alumina as a major component. 4 . The electrostatic chuck according to claim 1 , wherein a thickness of the joining layer is equal to or lower than 0.3 mm. 5 . The electrostatic chuck according to claim 1 , wherein a shape of at least a part of the filler materials is spherical.

Assignees

Inventors

Classifications

  • H10P72/722Primary

    Details of electrostatic chucks · CPC title

  • using electrostatic chucks · CPC title

  • Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating · CPC title

  • by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch · CPC title

  • Workpiece holder · CPC title

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Frequently asked questions

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What does patent US2025069933A1 cover?
An electrostatic chuck 10 includes a dielectric substrate 100, a base plate 200, and a joining layer 300 which joins the dielectric substrate 100 and the base plate 200. The joining layer 300 is obtained by containing a plurality of particulate filler materials 320 inside resin 310. The content of the filler materials 320 in the joining layer 300 is equal to or lower than 70% by weight.
Who is the assignee on this patent?
Toto Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/722. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Feb 27 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).