Bonded body manufacturing method and bonded body

Patent metadata

Field	Value
Publication number	US-2025059086-A1
Application number	US-202418934723-A
Country	US
Kind code	A1
Filing date	Nov 1, 2024
Priority date	Mar 31, 2020
Publication date	Feb 20, 2025
Grant date	—

Abstract

A method of manufacturing a bonded body includes: a preparation step of interposing a sealing material (6) containing glass between a highly thermal conductive substrate (2) and a glass substrate (3); and a bonding step of forming a sealing layer (4) by irradiating the sealing material (6) with laser light (L). The bonding step includes: a first heating step of preheating the sealing material (6) at a temperature lower than a softening point of the sealing material (6) or a temperature at which the sealing material (6) is prevented from softening and flowing by irradiation with the laser light (L); and a second heating step of heating, after the second heating step, the sealing material (6) at a temperature equal to or higher than the softening point of the sealing material (6) or a temperature at which the sealing material (6) softens and flows by irradiation with the laser light (L).

First claim

1 - 2 . (canceled)

3 . A method of manufacturing a bonded body comprising a highly thermal conductive substrate, a glass substrate, and a sealing layer configured to bond the highly thermal conductive substrate and the glass substrate to each other,
the method comprising: a preparation step of interposing a sealing material containing glass between the highly thermal conductive substrate and the glass substrate; and a bonding step of forming the sealing layer by irradiating the sealing material with laser light, wherein the bonding step comprises: a first heating step of preheating the sealing material by irradiation with the laser light; and a second heating step of heating, after the first heating step, the sealing material by irradiation with the laser light, and wherein an output of the laser light in the first heating step is smaller than an output of the laser light in the second heating step.

4 . The method of manufacturing a bonded body according to claim 3 ,
wherein, in the preparation step, the sealing material is formed into a closed curve shape, and wherein, in the first heating step, the laser light is scanned so as to orbit a plurality of times along a circumferential direction of the sealing material.

5 . The method of manufacturing a bonded body according to claim 3 , wherein, in the second heating step, the laser light having an output larger than an output of the laser light in the first heating step is radiated to the sealing material.

6 . The method of manufacturing a bonded body according to claim 3 , wherein the highly thermal conductive substrate is a silicon substrate.

7 . The method of manufacturing a bonded body according to claim 3 , wherein the laser light is a semiconductor laser.

8 . The method of manufacturing a bonded body according to claim 3 , wherein the bonded body further comprises an element between the highly thermal conductive substrate and the glass substrate.

9 . The method of manufacturing a bonded body according to claim 3 , further comprising, before the preparation step, a step of forming a silicon oxide film or a silicon nitride film on a surface of the highly thermal conductive substrate, to thereby interpose the silicon oxide film or the silicon nitride film between the highly thermal conductive substrate and the sealing layer.

10 - 15 . (canceled)

Assignees

• Nippon Electric Glass Co

Inventors

• Shiragami Toru

Classifications

• H10W76/60

  Seals · CPC title

• H10W76/10

  Containers or parts thereof · CPC title

• C03C2203/52

  Heat-treatment · CPC title

• B23K26/57

  the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming · CPC title

• B23K2101/36

  Electric or electronic devices · CPC title