Bonded body manufacturing method and bonded body
US-2025059086-A1 · Feb 20, 2025 · US
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Patent family 77929944
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 77929944 |
| Family type | — |
| Earliest priority | Mar 31, 2020 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US2025059086A1 — Bonded body manufacturing method and bonded body |
Representative publication
Best representative member for this family based on priority and filing country.
US2025059086A1 — Bonded body manufacturing method and bonded body (published Feb 20, 2025)
Member publications
Related publications in this family.
Bonded body manufacturing method and bonded body
US-12172925-B2 · Dec 24, 2024 · US
Bonded body manufacturing method and bonded body
US-2024043323-A1 · Feb 8, 2024 · US