Laser welded glass packages

Patent metadata

Field	Value
Publication number	US-10457595-B2
Application number	US-201515522198-A
Country	US
Kind code	B2
Filing date	Oct 29, 2015
Priority date	Oct 31, 2014
Publication date	Oct 29, 2019
Grant date	Oct 29, 2019

Abstract

A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σtensile stress location)/(σinterface laser weld))<<1 or <1 and σinterface laser weld>10 MPa or >1 MPa where σtensile stress location is the stress present in the first substrate and σinterface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

First claim

We claim:

1. An apparatus comprising:
a first substrate having a first surface;
an inorganic film formed over the first surface of the first substrate;
a second substrate adjacent the first substrate, wherein the inorganic film is between the first substrate and the second substrate; and
a weld formed by the inorganic film at an interface between the first substrate and the adjacent second substrate bonding the first substrate and the second substrate,
wherein the weld is characterized by

(

σ

tensile
⁢

⁢
stress
⁢

⁢
location

σ

interface
⁢

⁢
laser
⁢

⁢
weld

)

<
1

and σ tensile laser weld >1 MPa
wherein σ tensile stress location is the stress present in the first substrate and σ tensile laser weld is the stress present at the interface,
wherein each of the inorganic film, the first substrate and the second substrate are transmissive at approximately 420 nm to approximately 750 nm.

2. An apparatus comprising:
a first substrate having a first surface;
an inorganic film formed over the first surface of the first substrate;
a second substrate adjacent the first substrate, wherein the inorganic film is between the first substrate and the second substrate; and
a weld formed by the inorganic film at an interface between the first substrate and the adjacent second substrate bonding the first substrate and the second substrate,
wherein the weld is characterized by

(

σ

tensile
⁢

⁢
stress
⁢

⁢
location

σ

interface
⁢

⁢
laser
⁢

⁢
weld

)

⪡
1

and σ interface laser weld >10 MPa
wherein σ tensile stress location is the stress present in the first substrate and σ tensile laser weld is the stress present at the interface,
wherein each of the inorganic film, the first substrate and the second substrate are transmissive at approximately 420 nm to approximately 750 nm.

3. The apparatus of claim 2 or 1 further comprising:
a device protected between the first substrate and the second substrate wherein the inorganic film is in contact with the second substrate.

4. The apparatus of claim 3 , wherein absorption by the inorganic film is more than 10% at a predetermined laser wavelength.

5. The apparatus of claim 3 , wherein the composition of the inorganic film is selected from the group consisting of SnO 2 , ZnO, TiO 2 , ITO, Zn, Ti, Ce, Pb, Fe, Va, Cr, Mn, Mg, Ge, SnF 2 , ZnF 2 and combinations thereof.

6. The apparatus of claim 3 , wherein the composition of the inorganic film is selected to lower the activation energy for inducing creep flow of the first substrate, the second substrate, or both the first and second substrates.

7. The apparatus of claim 3 , wherein the composition of the inorganic film is laser absorbing low liquidus temperature material with a liquidus temperature less than or equal to about 1000° C.

8. The apparatus of claim 3 , wherein the composition of the inorganic film comprises:
20-100 mol % SnO;
0-50 mol % SnF 2 ; and
0-30 mol % P 2 O 5 or B 2 O 3 .

9. The apparatus of claim 3 , wherein the inorganic film and the first and second substrates have a combined internal transmission of more than 80% at approximately 420 nm to approximately 750 nm.

Assignees

• Corning Inc

Inventors

• Boek Heather Debra
• Dabich Ii Leonard Charles
• Deneka David Alan
• Kim Jin Su
• Koval Shari Elizabeth
• Logunov Stephan Lvovich
• Quesada Mark Alejandro
• Streltsov Alexander Mikhailovich

Classifications

• C03C3/247

  containing fluorine and phosphorus · CPC title

• C03C17/23

  Oxides (C03C17/02 takes precedence) · CPC title

• C03C3/16

  containing phosphorus · CPC title

• C03C2217/285

  Fluorides · CPC title

• C03C27/10 Primary

  with the aid of adhesive specially adapted for that purpose · CPC title