Metrology target design for tilted device designs

Patent metadata

Field	Value
Publication number	US-2025035489-A1
Application number	US-202418915015-A
Country	US
Kind code	A1
Filing date	Oct 14, 2024
Priority date	Apr 21, 2015
Publication date	Jan 30, 2025
Grant date	—

Abstract

Metrology methods, modules and targets are provided, for measuring tilted device designs. The methods analyze and optimize target design with respect to the relation of the Zernike sensitivity of pattern placement errors (PPEs) between target candidates and device designs. Monte Carlo methods may be applied to enhance the robustness of the selected target candidates to variation in lens aberration and/or in device designs. Moreover, considerations are provided for modifying target parameters judiciously with respect to the Zernike sensitivities to improve metrology measurement quality and reduce inaccuracies.

First claim

What is claimed is:

1 . A metrology target comprising:
a first set of cells having a first set of two or more periodic features in a first layer of a sample distributed along a measurement direction; and a second set of cells having the two or more periodic features in a second layer of the sample distributed along the measurement direction, a particular periodic feature of the two or more periodic features in any of the first or second sets of cells comprises:
a tilted segmentation area bounded by bounding segments along the measurement direction, wherein the tilted segmentation area includes two or more tilted segmentation features distributed with a tilted segmentation pitch along a tilt angle, wherein the tilt angle corresponds to a tilt angle of tilted device features in the respective layer of the sample, wherein the tilted segmentation pitch is selected to match a pattern placement error of the two or more periodic features in the respective layer to a pattern placement error of the tilted device features in the respective layer according to a Zernike polynomial analysis, wherein a measurement of positions of the first set of cells with respect to the second set of cells along the measurement direction is indicative of overlay along the measurement direction.

2 . The metrology target of claim 1 , wherein the first set of cells and the second set of cells are rotationally-symmetric advanced imaging metrology (AIM) cells.

3 . The metrology target of claim 1 , wherein the tilted segmentation pitch of the two or more periodic features equal to a tilted segmentation pitch of the tilted device features in the respective layer.

4 . The metrology target of claim 1 , wherein the tilted segmentation pitch of the two or more periodic features is in a range of 10%-30% larger than a tilted segmentation pitch of the tilted device features in the respective layer.

5 . The metrology target of claim 1 , wherein the tilted segmentation pitch of the two or more periodic features in the first set of cells is equal to the tilted segmentation pitch of the two or more periodic features in the second set of cells.

6 . The metrology target of claim 1 , wherein the tilted segmentation pitch of the two or more periodic features in the first set of cells is different than the tilted segmentation pitch of the two or more periodic features in the second set of cells.

7 . The metrology target of claim 1 , wherein the tilt angle of the tilted segmentation areas of two or more periodic features in the first set of cells is equal to the tilt angle of the tilted segmentation areas of two or more periodic features in the second set of cells.

8 . The metrology target of claim 1 , wherein the tilt angle of the tilted segmentation areas of two or more periodic features in the first set of cells is different than the tilt angle of the tilted segmentation areas of two or more periodic features in the second set of cells.

9 . The metrology target of claim 1 , wherein the bounding segments are further segmented to include optical proximity correction (OPC) features.

10 . The metrology target of claim 1 , wherein the OPC features comprise:
sub-resolution assist features.

11 . The metrology target of claim 10 , wherein at least one of a size, segmentation, or tilt angle of the SRAF features are selected to match the pattern placement error of the two or more periodic features in the respective layer to the pattern placement error of the tilted device features in the respective layer according to the Zernike polynomial analysis.

12 . The metrology target of claim 1 , wherein the Zernike polynomial analysis comprises:
simulating pupil plane positions of zeroth and first diffraction order signals of an initial target design of the metrology target and of a design of the tilted devices; and modifying at least one parameter of the initial target design to yield an improved target design, the modification carried out to provide a relation between the pupil plane positions of zeroth and first diffraction order signals in the improved target that corresponds to a relation thereof in the device design.

13 . The metrology target of claim 12 , wherein the at least one Zernike polynomial is asymmetric with respect to a segmentation direction of the initial target.

14 . The metrology target of claim 1 , wherein the Zernike polynomial analysis comprises:
calculating a Zernike sensitivity of pattern placement errors of at least one device design of the tilted device and of a plurality of metrology target designs of the metrology target; and selecting a best metrology target design according to a value of a cost function derived from the calculated Zernike sensitivities, the cost function quantifying a similarity of the Zernike sensitivity between the at least one device design and the plurality of metrology target designs.

15 . The metrology target of claim 1 , wherein the Zernike polynomial analysis comprises:
for each of at least one device design and a plurality of target design candidates of the metrology target:
repeatedly for a plurality of runs:
generating a plurality of Ni (Ni>50) Zernike coefficient values for each of a plurality of Zernike polynomials Zi, the values generated pseudo-randomly with respect to specified distributions over specified ranges,
calculating PPEs for each of the Zernike polynomials;
calculating a respective PPE measure for the run;
deriving a distribution of the calculated respective PPE measures;
correlating each of the derived target design candidate distributions with the at least one derived device design distribution to yield for each target design candidate a device correspondence measure; and
selecting a best metrology target design according to the derived device correspondence measures.

16 . The metrology target of claim 1 , wherein the Zernike polynomial analysis comprises:
comparing a Zernike sensitivity of pattern placement errors (PPEs) between an initial target design of the metrology target and at least one device design of the tilted device with respect to at least two directions; estimating a process window for the initial target design; and deriving an improved metrology target design from the initial target design by modifying the initial target design to increase a correspondence in the Zernike sensitivity and to increase the process window.

17 . A metrology module comprising:
at least one computer processor configured to:
design a metrology target to include:
a first set of cells having a first set of two or more periodic features in a first layer of a sample distributed along a measurement direction; and
a second set of cells having the two or more periodic features in a second layer of the sample distributed along the measurement direction, a particular periodic feature of the two or more periodic features in any of the first or second sets of cells includes a tilted segmentation area bounded by bounding segments along the measurement direction, wherein the tilted segmentation area includes two or more tilted segmentation features distributed with a tilted segmentation pitch along a tilt angle, wherein the tilt angle corresponds to a tilt angle of tilted device features in the respective layer of the sample; and

select the tilted segmentation pitch to match a pattern placement error of the two or more periodic features in the respective layer to a pattern placement error of the tilted device features in the respective layer according to a Zernike polynomial analysis, wherein a measurement of positions of the first

Assignees

• Kla Corp

Inventors

• Lee Myungjun
• Smith Mark D
• Adel Michael E
• Amit Eran
• Kandel Daniel

Classifications

• H10P74/27

  Structural arrangements therefor · CPC title

• G03F7/705 Primary

  Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title

• G03F7/70683 Primary

  Mark designs · CPC title

• G03F7/70591

  Testing optical components · CPC title

• G01J9/00 Primary

  Measuring optical phase difference (devices or arrangements for controlling the phase of light beams G02F1/01); Determining degree of coherence; Measuring optical wavelength (spectrometry G01J3/00) · CPC title