Low inductance bus assembly and power converter apparatus including the same

Patent metadata

Field	Value
Publication number	US-2024396466-A1
Application number	US-202418440098-A
Country	US
Kind code	A1
Filing date	Feb 13, 2024
Priority date	Oct 25, 2018
Publication date	Nov 28, 2024
Grant date	—

Abstract

An apparatus, such as a power converter, includes first, second and third core bus plates arranged in parallel. The apparatus also includes a first bus extension plate joined to the first core bus plate and extending therefrom at a first angle and a second bus extension plate joined to the second core bus plate and extending therefrom at a second angle. The apparatus further includes a third bus extension plated joined with the third core bus plate and disposed parallel to the first bus extension plate and a fourth bus extension plate joined with the third core bus plate and disposed parallel to the second bus extension plate.

First claim

That which is claimed:

1 . An apparatus comprising:
first and second semiconductor switching devices disposed opposite one another at respective ones of opposing first and second surfaces; a first bus comprising a first conductive plate disposed between the first and second surfaces and extending in a first direction towards the first surface to electrically connect to the first semiconductor switching device; a second bus comprising a second conductive plate disposed between the first and second surfaces and extending in a second direction perpendicular to the first direction towards the second surface to electrically connect to the second semiconductor switching device; and a third bus comprising:
a third conductive plate disposed parallel to the first conductive plate and electrically connected to the first semiconductor switching device; and
a fourth conductive plate disposed parallel to the second conductive plate and electrically connected to the second semiconductor switching device and the third conductive plate.

2 . The apparatus of claim 1 :
wherein the first bus further comprises a fifth conductive plate disposed between the first and second surfaces and parallel thereto and joined to the first conductive plate; wherein the second bus comprises a sixth conductive plate disposed between the first and second surfaces and parallel to the fifth conductive plate and joined to the second conductive plate; and wherein the third bus comprises a seventh conductive plate disposed between the fifth and sixth conductive plates and joined to the third and fourth conductive plates.

Assignees

• Eaton Intelligent Power Ltd

Inventors

• Nojima Geraldo

Classifications

• H05K5/30

  Side-by-side or stacked arrangements · CPC title

• H05K7/04

  on conductive chassis · CPC title

• H05K5/04

  Metal casings · CPC title

• H05K5/0247

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• H02M7/797

  using semiconductor devices only · CPC title