Adaptive baking method

Patent metadata

Field	Value
Publication number	US-2024393051-A1
Application number	US-202418790727-A
Country	US
Kind code	A1
Filing date	Jul 31, 2024
Priority date	Mar 7, 2014
Publication date	Nov 28, 2024
Grant date	—

Abstract

A controller includes a non-transitory computer readable medium configured to store information related to a target temperature of a wafer, a target temperature of a heating element, a temperature of the wafer, and a temperature of the heating element. The controller further includes a processor connected to the non-transitory computer readable medium, the processor configured to generate at least one heating signal during a baking process to adjust a duration of an entirety of the baking process in response to the temperature of the wafer and the temperature of the heating element.

First claim

What is claimed is:

1 . A controller comprising:
a non-transitory computer readable medium configured to store information related to a target temperature of a wafer, a target temperature of a heating element, a temperature of the wafer, and a temperature of the heating element; and a processor connected to the non-transitory computer readable medium, the processor configured to generate at least one heating signal during a baking process to adjust a duration of an entirety of the baking process in response to the temperature of the wafer and the temperature of the heating element.

2 . The controller of claim 1 , wherein the processor is further configured to generate a plurality of heating signals, wherein each heating signal of the plurality of heating signals corresponds to a heating zone of a plurality of heating zones of the heating element.

3 . The controller of claim 1 , wherein the processor is configured to generate the at least one heating signal for a first heating zone of the heating element based on an amount of heat provided by a plurality of heating zones of the heating element adjacent to the first heating zone.

4 . A controller comprising:
a non-transitory computer readable medium configured to store instructions; and a processor connected to the non-transitory computer readable medium, wherein the processor is configured to execute the instructions for:
controlling a heating element for implementing a baking process on a wafer;
receiving a temperature of the heating element and a temperature of the wafer during a first duration of the baking process to obtain temperature information related to both the heating element and the wafer; and
decreasing, during the first duration, an amount of heat provided by the heating element as a rate of change of the temperature information versus time increases.

5 . The controller of claim 4 , wherein the processor is configured to execute the instructions for individually controlling each of a plurality of heating zones of the heating element.

6 . The controller of claim 4 , wherein the processor is configured to execute the instructions for controlling a resistive heater of the heating element.

7 . The controller of claim 4 , wherein the processor is configured to execute the instructions for controlling a fluid flowing through the heating element.

8 . The controller of claim 4 , wherein the processor is configured to execute the instructions for controlling an infrared light source.

9 . The controller of claim 4 , wherein the processor is configured to execute the instructions for increasing a duration of the baking process beyond the first duration in response to the temperature of the wafer being below a target temperature.

10 . The controller of claim 9 , wherein the processor is configured to execute the instructions for determining the duration based on a target heating rate of the target temperature.

11 . The controller of claim 4 , wherein the processor is configured to execute the instructions for controlling the heating element uniformly.

12 . A controller comprising:
a non-transitory computer readable medium configured to store instructions; and a processor connected to the non-transitory computer readable medium, wherein the processor is configured to execute the instructions for:
controlling a heating element for performing a baking process on a wafer, wherein the baking process comprises heating the wafer for a first duration;
receiving a temperature of the heating element and a temperature of the wafer during the first duration to obtain temperature information related to both the heating element and the wafer; and
increasing a duration of the baking process beyond the first duration in response to the temperature information.

13 . The controller of claim 12 , wherein the processor is configured to execute the instructions for decreasing, during the first duration, an amount of heat provided by the heating element as a rate of change of the temperature information versus time increases.

14 . The controller of claim 12 , wherein the processor is configured to execute the instructions for individually controlling each of a plurality of heating zones the heating element.

15 . The controller of claim 12 , wherein the processor is configured to execute the instructions for controlling the heating element uniformly.

16 . The controller of claim 12 , wherein the processor is configured to execute the instructions for determining a magnitude of the duration based on a rate of heating for target temperature information.

17 . The controller of claim 12 , wherein the processor is configured to execute the instructions for increasing the duration by transmitting signals to the heating element.

18 . The controller of claim 12 , wherein the processor is configured to execute the instructions for controlling a first heating zone of a plurality of heating zones of the heating element based on an amount of heat provided by a second heating zone of the plurality of heating zones.

19 . The controller of claim 18 , wherein the processor is configured to execute the instructions for controlling the first heating zone based on the second heating zone adjacent to the first heating zone.

20 . The controller of claim 12 , wherein the processor is configured to execute the instructions for performing the baking process comprises by controlling an infrared light source or controlling flow of a heating fluid through the heating element.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Wu Tzung-Chen
• Lee Heng-Jen
• Hwang Ho-Yung David
• Zhou Wen-Zhan

Classifications

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• F27D2019/0003

  Monitoring the temperature or a characteristic of the charge and using it as a controlling value · CPC title

• G03F7/168

  Finishing the coated layer, e.g. drying, baking, soaking · CPC title