Wafer dicing devices and methods of wafer dicing

Patent metadata

Field	Value
Publication number	US-2024375212-A1
Application number	US-202318514705-A
Country	US
Kind code	A1
Filing date	Nov 20, 2023
Priority date	May 12, 2023
Publication date	Nov 14, 2024
Grant date	—

Abstract

Examples of the present disclosure provide a wafer dicing device and a method of wafer dicing, the wafer dicing device including: a bearing platform, a first dicing sub device and a second dicing sub device, wherein the bearing platform is configured to bear the wafer to be diced, the first dicing sub device is configured to dice the wafer to be diced from a first side, and the second dicing sub device is configured to dice the wafer to be diced from a second side, the first side and the second side being opposite sides of the bearing platform in a first direction, the first direction being a direction of the thickness of the bearing platform.

First claim

What is claimed is:

1 . A wafer dicing device, comprising: a bearing platform, a first dicing sub device and a second dicing sub device, wherein:
the bearing platform is configured to bear a wafer to be diced; the first dicing sub device is configured to dice the wafer to be diced from a first side; and the second dicing sub device is configured to dice the wafer to be diced from a second side, the first side and the second side being opposite sides of the bearing platform in a first direction, and the first direction being a direction of a thickness of the bearing platform.

2 . The wafer dicing device of claim 1 , wherein both of the first dicing sub device and the second dicing sub device are configured to perform laser dicing.

3 . The wafer dicing device of claim 1 , wherein the first dicing sub device comprises a first focusing lens located on the first side, and the second dicing sub device comprises a second focusing lens located on the second side, the first focusing lens and the second lens being aligned in the first direction when dicing the wafer to be diced.

4 . The wafer dicing device of claim 3 , wherein positions of the first focusing lens and the second focusing lens in the wafer dicing device are unmovable, and the first focusing lens and the second focusing lens are aligned in the first direction.

5 . The wafer dicing device of claim 3 , wherein positions of the first focusing lens and the second focusing lens in the wafer dicing device are movable, and the first focusing lens and the second focusing lens are aligned in the first direction by adjusting the positions of the first focusing lens and the second focusing lens when dicing the wafer to be diced.

6 . The wafer dicing device of claim 3 , wherein the first dicing sub device further comprises a first laser configured to supply a first laser beam to the first focusing lens; and
the second dicing sub device further comprises a second laser configured to supply a second laser beam to the second focusing lens.

7 . The wafer dicing device of claim 3 , wherein the first dicing sub device and the second dicing sub device each further comprise a first laser that is configured to supply a first laser beam to the first focusing lens and a second laser beam to the second focusing lens.

8 . The wafer dicing device of claim 6 , wherein the first laser is located on the first side and the second laser is located on the second side; wherein the first laser is aligned with the first focusing lens in the first direction and the second laser is aligned with the second focusing lens in the first direction.

9 . The wafer dicing device of claim 6 , wherein both the first laser and the second laser are located on the first side, or the second side;
the first dicing sub device further comprises at least one first mirror configured to direct the first laser beam generated by the first laser into the first focusing lens; and the second dicing sub device further comprises at least one second mirror configured to direct the second laser beam generated by the second laser into the second focusing lens.

10 . The wafer dicing device of claim 1 , wherein the bearing platform has an opening disposed therein, and the opening exposes a dicing street of the wafer to be diced when the wafer to be diced is placed on the bearing platform.

11 . The wafer dicing device of claim 1 , wherein a position of the bearing platform in the wafer dicing device is movable, and the wafer to be diced is diced at different positions by moving the bear platform when dicing the wafer to be diced.

12 . A method of wafer dicing, comprising:
placing a wafer to be diced on a bearing platform; and dicing the wafer to be diced from a first side by a first dicing sub device; and dicing the wafer to be diced from a second side by a second dicing sub device, the first side and the second side being opposite sides of the bearing platform in a first direction, and the first direction being a direction of a thickness of the bearing platform.

13 . The method of claim 12 , wherein both of the first dicing sub device and the second dicing sub device are configured to perform laser dicing.

14 . The method of claim 12 , wherein the first dicing sub device comprises a first focusing lens located on the first side, and the second dicing sub device comprises a second focusing lens located on the second side; and
dicing the wafer to be diced from the first side by the first dicing sub device and dicing the wafer to be diced from the second side by the second dicing sub device comprises: aligning the first focusing lens and the second focusing lens in the first direction when dicing the wafer to be diced.

15 . The method of claim 14 , wherein the aligning the first focusing lens and the second focusing lens in the first direction comprises:
setting positions of the first focusing lens and the second focusing lens to be unmovable in the wafer dicing device and aligning the first focusing lens and the second focusing lens in the first direction, wherein the positions of the first focusing lens and the second focusing lens are not adjusted when dicing the wafer to be diced.

16 . The method of claim 14 , wherein the aligning the first focusing lens and the second focusing lens in the first direction comprises:
setting positions of the first focusing lens and the second focusing lens to be movable in the wafer dicing device and adjusting the positions of the first focusing lens and the second focusing lens such that the first focusing lens and the second focusing lens are aligned in the first direction when dicing the wafer to be diced.

17 . The method of claim 14 , wherein the first dicing sub device further comprises a first laser and the second dicing sub device further comprises a second laser; and
dicing the wafer to be diced from the first side by the first dicing sub device and dicing the wafer to be diced from the second side by the second dicing sub device comprises:
supplying a first laser beam to the first focusing lens by the first laser to dice the wafer to be diced from the first side and supplying a second laser beam to the second focusing lens by the second laser to dice the wafer to be diced from the second side.

18 . The method of claim 14 , wherein the first dicing sub device and the second dicing device each further comprise a first laser; and
dicing the wafer to be diced from the first side by the first dicing sub device and dicing the wafer to be diced from the second side by the second dicing sub device comprises:
supplying a first laser beam to the first focusing lens by the first laser to dice the wafer to be diced from the first side and supplying a second laser beam to the second focusing lens by the first laser to dice the wafer to be diced from the second side.

19 . The method of claim 12 , wherein a position of the bearing platform in the wafer dicing device is movable; and
dicing the wafer to be diced from the first side by the first dicing sub device and dicing the wafer to be diced from the second side by the second dicing sub device comprises:
moving the bearing platform to dice the wafer to be diced at different positions when dicing the wafer to be diced.

Assignees

• Yangtze Memory Tech Co Ltd

Inventors

• Xie Wei
• Mo Ping
• Liu Lei
• Lv Zhong
• Xia Zhiliang
• Huo Zongliang

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• B23K26/38

  by boring or cutting · CPC title