Semiconductor device, chip and fabrication method thereof, memory system
US-2025054905-A1 · Feb 13, 2025 · US
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Mo Ping patents
Mo Ping is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mo Ping |
| Total patents | 5 |
| First publication | Sep 19, 2024 |
| Latest publication | Feb 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip packaging structure, semiconductor structure, and fabricating method thereof
US-2025038063-A1 · Jan 30, 2025 · US
Semiconductor devices and fabrication methods thereof and memory and memory systems
US-2024381642-A1 · Nov 14, 2024 · US
Wafer dicing devices and methods of wafer dicing
US-2024375212-A1 · Nov 14, 2024 · US
Semiconductor device, fabricating method, memory device and device system
US-2024312925-A1 · Sep 19, 2024 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Yangtze Memory Tech Co Ltd | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B43/27 | 3 |
| H10W42/121 | 3 |
| H10P54/00 | 3 |
| H10W90/00 | 2 |
| H10W72/0198 | 2 |