Systems and methods for microvoid analysis in crystals grown by continuous czochralski pullers

US2024352616A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2024352616-A1
Application numberUS-202418635262-A
CountryUS
Kind codeA1
Filing dateApr 15, 2024
Priority dateApr 18, 2023
Publication dateOct 24, 2024
Grant date

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Abstract

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A computer device includes at least one processor in communication with at least one memory device. The at least one processor is programmed to: a) receive at least one image of a silicon melt of a crystal in a crucible; b) execute a model trained to segment the at least one image into different classes; c) analyze segmentation to determine a quality of the crystal; and/or d) approve or reject the crystal based upon the analysis.

First claim

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What is claimed is: 1 . A computer device comprising at least one processor in communication with at least one memory device, wherein the at least one processor programmed to: receive at least one image of a silicon melt of a crystal in a crucible; execute a model trained to segment the at least one image into different classes; analyze segmentation to determine a quality of the crystal; and approve or reject the crystal based upon the analysis. 2 . The computer device of claim 1 , wherein the silicon melt is associated with a Continuous Czochralski process. 3 . The computer device of claim 2 , wherein the crucible is a triple crucible. 4 . The computer device of claim 1 , wherein the model is trained to segment the at least one image pixel by pixel. 5 . The computer device of claim 4 , wherein the model generates an output of a segmented image. 6 . The computer device of claim 5 , wherein the at least one processor is further programmed to mask the segmented image to determine a percentage of area associated with one or more classifications. 7 . The computer device of claim 4 , wherein the model is trained to segment the at least one image into a plurality of segments including, but not limited to, background, silicon melt liquid, cullet, and crucible. 8 . The computer device of claim 1 , wherein the at least one processor is programmed to reject the crystal if an area of silicon melt liquid exceeds one fourth of a total surface area in the crucible. 9 . The computer device of claim 1 , wherein the model is a semantic segmentation network, and wherein the at least one processor is further programmed to train the model with a plurality of pixel-labeled images for the model to classify pixels of images into pixel categories. 10 . The computer device of claim 9 , wherein the at least one processor is further programmed to retrain the model with a subsequent plurality of pixel-labeled images. 11 . The computer device of claim 1 , wherein the at least one processor is further programmed to approve or reject the crystal based upon a number of micro-voids predicted to occur in the crystal based upon the analysis. 12 . The computer device of claim 1 , wherein the at least one image is received from a camera positioned perpendicular to an external silicon melt annulus. 13 . A computer-implemented method performed by a computer system including at least one processor in communication with a chatbot and at least one memory device, the method comprising: receiving at least one image of a silicon melt of a crystal in a crucible; executing a model trained to segment the at least one image into different classes; analyzing segmentation to determine a quality of the crystal; and approving or rejecting the crystal based upon the analysis. 14 . The computer-implemented method of claim 13 , wherein the silicon melt is associated with a Continuous Czochralski process. 15 . The computer-implemented method of claim 14 , wherein the crucible is a triple crucible. 16 . The computer-implemented method of claim 13 , wherein the model is trained to segment the at least one image pixel by pixel. 17 . The computer-implemented method of claim 16 , wherein the model generates an output of a segmented image. 18 . The computer-implemented method of claim 17 further comprising masking the segmented image to determine a percentage of area associated with one or more classifications. 19 . The computer-implemented method of claim 16 , wherein the model is trained to segment the at least one image into a plurality of segments including, but not limited to, background, silicon melt liquid, cullet, and crucible. 20 . The computer-implemented method of claim 13 further comprising rejecting the crystal if an area of silicon melt liquid exceeds one fourth of a total surface area in the crucible. 21 . The computer-implemented method of claim 13 , wherein the model is a semantic segmentation network, and wherein the method further compromises training the model with a plurality of pixel-labeled images for the model to classify pixels of images into pixel categories. 22 . The computer-implemented method of claim 21 further comprising retraining the model with a subsequent plurality of pixel-labeled images. 23 . The computer-implemented method of claim 13 further comprising approving or rejecting the crystal based upon a number of micro-voids predicted to occur in the crystal based upon the analysis. 24 . The computer-implemented method of claim 13 , wherein the at least one image is received from a camera positioned perpendicular to an external silicon melt annulus.

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What does patent US2024352616A1 cover?
A computer device includes at least one processor in communication with at least one memory device. The at least one processor is programmed to: a) receive at least one image of a silicon melt of a crystal in a crucible; b) execute a model trained to segment the at least one image into different classes; c) analyze segmentation to determine a quality of the crystal; and/or d) approve or reject …
Who is the assignee on this patent?
Globalwafers Co Ltd
What technology area does this patent fall under?
Primary CPC classification C30B15/26. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Oct 24 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).