Holding element for a high-temperature furnace

Patent metadata

Field	Value
Publication number	US-2024247873-A1
Application number	US-202218562431-A
Country	US
Kind code	A1
Filing date	May 12, 2022
Priority date	May 19, 2021
Publication date	Jul 25, 2024
Grant date	—

Abstract

A ceramic holding element for a high-temperature furnace includes at least one fastening portion formed on a part of the holding element surface for mechanically connecting the holding element to a supporting structure. At least one heat conductor receiving portion on a part of the holding element surface receives a heat conductor. At least one groove is formed on a peripheral part of the surface of the holding element between the fastening portion and the heat conductor receiving portion. The groove extends substantially over the entire periphery of the peripheral part and at least one imaginary path between the fastening portion and the heat conductor receiving portion along the holding element surface crosses the groove. The groove has an aspect ratio, formed by a depth to width ratio of the groove, being greater than or equal to 1.5.

First claim

1 - 15 . (canceled)

16 . A holding element made of ceramic for a high-temperature furnace, the holding element comprising:
a surface of the holding element, said surface having a peripheral part with a periphery; at least one fastening portion formed on a part of said surface of the holding element for mechanically connecting the holding element to a supporting structure; at least one heat conductor receiving portion formed on a part of said surface of the holding element for receiving a heat conductor; said peripheral part being located between said fastening portion and said heat conductor receiving portion; said peripheral part of said surface having at least one groove formed thereon having a depth and a width; said groove extending substantially entirely over said periphery of said peripheral part of said surface and defining at least one imaginary path between said fastening portion and said heat conductor receiving portion along said surface of the holding element crossing said at least one groove; and said at least one groove having an aspect ratio, formed by a ratio of said depth to said width, of greater than or equal to 1.5.

17 . The holding element according to claim 16 , wherein said at least one groove is a plurality of grooves.

18 . The holding element according to claim 16 , wherein said at least one groove includes two or three grooves.

19 . The holding element according to claim 16 , wherein said depth of said at least one groove is between 3 mm and 10 mm.

20 . The holding element according to claim 16 , wherein said width of said at least one groove is between 0.25 mm and 3 mm.

21 . The holding element according to claim 16 , wherein:
said at least one groove has an undercut in at least some portions; said undercut, at least in some portions, defines a first free groove cross section disposed at a first spacing from the surface of the holding element and a second free groove cross section disposed at a second spacing from the surface of the holding element; and said first spacing is smaller than second spacing.

22 . The holding element according to claim 16 , wherein said at least one groove has a widening at least in some portions, and said widening defines a free groove cross section being enlarged at least in some portions.

23 . The holding element according to claim 16 , wherein said at least one groove is formed at a point along the surface of the holding element, and said at least one groove has a main direction of extent deviating at least at said point from a direction of a plane normal.

24 . The holding element according to claim 16 , wherein the holding element is configured monolithically.

25 . The holding element according to claim 16 , wherein the holding element is configured as a through-passage through a shield.

26 . The holding element according to claim 16 , wherein the holding element is formed of a binder-based material.

27 . The holding element according to claim 16 , wherein the holding element is formed of an additive material.

28 . The holding element according to claim 26 , wherein the material is a powder-injection-molded material.

29 . A high-temperature furnace, comprising at least one holding element according to claim 16 .

30 . A method for manufacturing a holding element, the method comprising using a binder-based production method to manufacture the holding element according to claim 16 .

31 . The method for manufacturing a holding element according to claim 30 , which further comprises selecting the binder-based production method from a group of production methods including filament printing and powder injection molding.

Assignees

• Plansee Se

Inventors

• Mallaun Peter
• Handtrack Dirk
• Kleinpass Bernd
• Partner Lukas

Classifications

• B33Y10/00

  Processes of additive manufacturing · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title

• F27D11/02 Primary

  Ohmic resistance heating · CPC title

• F27D2099/0008

  Resistor heating · CPC title

• F27D99/0006

  Electric heating elements or system · CPC title