Semiconductor device manufacturing apparatus

Patent metadata

Field	Value
Publication number	US-9644894-B2
Application number	US-201414468524-A
Country	US
Kind code	B2
Filing date	Aug 26, 2014
Priority date	Feb 28, 2014
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Provided is a heat treatment container having a small size and capable of efficiently performing a heat treatment on a SiC substrate. A heat treatment container is a container for a heat treatment on a SiC substrate 40 under Si vapor pressure. The SiC substrate 40 is made of, at least in a surface thereof, single crystal SiC. The heat treatment container includes a container part 30 and a substrate holder 50 . The container part 30 includes an internal space 33 in which Si vapor pressure is caused. The internal space 33 is partially open. The substrate holder 50 is able to support the SiC substrate 40 . When the substrate holder 50 supports the SiC substrate 40 , an open portion of the container part 30 is covered so that the internal space 33 is hermetically sealed.

First claim

What is claimed is:

1. A heat treatment container for a heat treatment on a SiC substrate under Si vapor pressure, the SiC substrate made of, at least in a surface thereof, single crystal SiC, the heat treatment container comprising:
a container part including an internal space in which Si vapor pressure is caused, the internal space being partially open; and
a substrate holder that is able to support the SiC substrate, the substrate holder configured such that, when the substrate holder supports the SiC substrate, an open portion of the container part is covered so that the internal space is hermetically sealed, wherein
the open portion of the internal space of the container part is covered by the SiC substrate,
the SiC substrate is placed on the substrate holder, thereby making the surface to be treated of the SiC substrate face the hermetically sealed space, and
the heat treatment container in which the SiC substrate is heated under the Si vapor pressure is for etching.

2. The heat treatment container according to claim 1 , wherein
the container part is configured such that the upper side of the internal space is open,
the upper side of the internal space is covered by the substrate holder supporting the SiC substrate.

3. The heat treatment container according to claim 2 , wherein
the heat treatment container includes, on an upper surface thereof, a container holder for supporting a lower surface of another heat treatment container.

4. The heat treatment container according to claim 3 , wherein
the substrate holder has a through hole, and the SiC substrate is supported on an edge portion arranged lateral to the through hole,
the container part includes a first step and a second step that is provided above the first step,
the first step supports an outer edge of the substrate holder, and makes the SiC substrate face the internal space, the SiC substrate exposed to the internal space through the through hole,
the second step supports a lower surface of another heat treatment container, the second step corresponding to the container holder.

5. The heat treatment container according to claim 1 , wherein
at least the container part includes a tantalum metal, a tantalum carbide layer arranged at the internal space side of the tantalum metal, and a tantalum silicide layer arranged at the further internal space side of the tantalum carbide layer.

6. The heat treatment container according to claim 5 , wherein
the tantalum silicide layer is provided over an entire wall surface that defines the internal space of the container part.

7. The heat treatment container according to claim 1 , wherein
the container part and the substrate holder are separatable from each other, and the substrate holder is replaceable.

8. A heat treatment container assembly including a plurality of the heat treatment containers according to claim 1 coupled to one another.

9. An apparatus for manufacturing a semiconductor device, the apparatus including the heat treatment container according to claim 1 .

Assignees

• Toyo Tanso Co

Inventors

• Torimi Satoshi
• Yabuki Norihito
• Nogami Satoru

Classifications

• H10P72/1922

  characterised by the construction of the closed carrier · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0421 Primary

  for drying etching · CPC title

• H10P72/18

  characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports · CPC title

• F27D2007/063

  Special atmospheres, e.g. high pressure atmospheres · CPC title