Method, apparatus and system for processing a composite waste source

Patent metadata

Field	Value
Publication number	US-2024247335-A1
Application number	US-202418421194-A
Country	US
Kind code	A1
Filing date	Jan 24, 2024
Priority date	Feb 8, 2016
Publication date	Jul 25, 2024
Grant date	—

Abstract

A method, apparatus and system for processing a composite waste source, such as e-waste, is disclosed. The composite waste source may comprise low-, moderate and high-melting point constituents, such as plastics, metals and ceramics. The composite waste source is heated to a first temperature zone, causing at least some of the low-melting point constituents to at least partially thermally transform. The composite waste source is subsequently heated to a second, higher, temperature zone, causing at least some of the moderate-melting point constituents to at least partially thermally transform. At least some of the at least partially thermally transformed constituents may be recovered. The method, apparatus and system disclosed may provide for the recovery and reuse of materials which would otherwise be sent to landfill or incinerated.

First claim

1 - 46 . (canceled)

47 . A method of processing electronic waste comprising plastic constituents, metal constituents and ceramic constituents, the method comprising:
heating the electronic waste to a first temperature of up to 350° C.; and heating the electronic waste from the first temperature to a second temperature of at least 850° C. at a rate of about 50° C./min or greater such that at least some of the metal constituents in the electronic waste are at least partially thermally transformed by melting, alloy formation and/or dissolution.

48 . The method of claim 47 , wherein at least some of the metal constituents are transformed into a metal alloy.

49 . The method of claim 47 , wherein the electronic waste is not heated above a temperature of 1250° C. such that lead is not vaporized.

50 . The method of claim 47 , wherein the electronic waste is heated to the first temperature in a first temperature zone, and the electronic waste is heated to the second temperature in a second temperature zone.

51 . The method of claim 47 , wherein at least some of the plastic constituents in the electronic waste are at least partially thermally transformed into gases and solid carbon in the second temperature zone.

52 . The method of claim 51 , wherein the gases assist in the reduction of any copper oxides present at the second temperature.

53 . The method of claim 51 , wherein the gases include carbon monoxide and hydrogen.

54 . The method of claim 47 , wherein, prior to heating the electronic waste to the first temperature, the electronic waste is pre-heated to a pre-treatment temperature that is lower than the first temperature.

55 . The method of claim 54 , wherein at the pre-treatment temperature at least some low-melting point metal constituents are transformed into metal alloys.

56 . The method of claim 55 , wherein the at least some low-melting point metal constituents include lead and tin.

57 . The method of claim 47 , further comprising the step of heating the electronic waste to at least one additional temperature zone, wherein the temperature in the at least one additional temperature zone is a higher temperature than the preceding temperature zone.

58 . The method of claim 47 , further comprising collecting at least some of the at least partially thermally transformed metal constituents at the second temperature.

59 . The method of claim 47 , wherein the method is conducted under inert conditions.

60 . The method of claim 47 , wherein the electronic waste is analyzed to determine its constituents prior to heating.

61 . The method of claim 47 , wherein, the metal constituents include copper, and the metal alloy is a copper-based metal alloy.

62 . The method of claim 61 , further comprising the step of:
heating the electronic waste to a third temperature, such that remaining copper in the electronic waste is melted.

63 . The method of claim 47 , wherein at least some of the metal constituents are recovered as molten metals and/or metal alloys.

64 . The method of claim 47 , wherein in the step of heating the electronic waste from the first temperature to the second temperature the temperatures avoid a temperature range of greater than 350° C.-less than 850° C.

65 . The method of claim 47 , wherein heating the electronic waste occurs in a gas furnace.

66 . The method of claim 65 , wherein the gas furnace uses a natural gas.

Assignees

• Newsouth Innovations Pty Ltd

Inventors

• Sahajwalla Veena

Classifications

• H05K2203/178

  Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials · CPC title

• H05K2203/1105

  Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• C22B25/02

  by dry processes · CPC title

• C22B15/0056

  Scrap treating · CPC title