Methods and systems for forming structures comprising a threshold voltage tuning layer

Patent metadata

Field	Value
Publication number	US-2024234129-A1
Application number	US-202418402950-A
Country	US
Kind code	A1
Filing date	Jan 3, 2024
Priority date	Jan 6, 2023
Publication date	Jul 11, 2024
Grant date	—

Abstract

Methods and systems for forming structure comprising a threshold voltage tuning layer are disclosed. Exemplary methods include providing a treatment reactant to a reaction chamber to form a treated surface on the substrate surface and depositing threshold voltage tuning material overlying the treated surface. Additionally or alternatively, exemplary methods can include direct formation of metal silicide layers. Additionally or alternatively, exemplary methods can include use of an etchant.

First claim

1 . A method of forming a structure comprising a threshold voltage tuning layer, the method comprising:
providing a substrate comprising a substrate surface within a reaction chamber; providing a treatment reactant comprising a metal treatment precursor to the reaction chamber to form a treated surface on the substrate surface; and depositing threshold voltage tuning material overlying the treated surface, wherein the treatment reactant inhibits deposition of the threshold voltage tuning material.

2 . The method of claim 1 , wherein the metal treatment precursor comprises a metal selected from one or more of hafnium, zirconium, or aluminum.

3 . The method of claim 1 , wherein the metal treatment precursor comprises one or more hafnium chloride (HfCl 4 ), tetrakis(ethylmethylamido)hafnium(TEMAHf), bis(methylcyclopentadienyl) methylmethoxy Hf, zirconium chloride (ZrCl 4 ), tetrakis(ethylmethylamido)zirconium(TEMAZr), bis(methylcyclopentadienyl) methylmethoxy Zr, or tris (dimethylamino) (cyclopentadienyl)zirconium.

4 . The method of claim 2 , wherein the substrate surface comprises the metal.

5 . The method of claim 1 , wherein the step of depositing threshold voltage tuning material comprises a cyclical deposition process comprising:
providing a threshold voltage tuning material precursor to the reaction chamber; and providing a threshold voltage tuning material reactant to the reaction chamber.

6 . The method of claim 5 , wherein the threshold voltage tuning material reactant removes a ligand of the treatment reactant on the treated surface.

7 . A method of forming a structure comprising a threshold voltage tuning layer, the method comprising:
providing a substrate comprising a substrate surface within a reaction chamber; providing a treatment reactant comprising a carbon-containing treatment precursor to the reaction chamber to form a treated surface on the substrate surface; and depositing threshold voltage tuning material overlying the treated surface.

8 . The method of claim 7 , wherein the carbon-containing treatment precursor comprises one or more of an aminosilane, an alkyl amine, and formamidine.

9 . The method of claim 7 , wherein the carbon-containing treatment precursor comprises one or more of an acyl halide or an alkyl diacyl halide.

10 . The method of claim 7 , wherein the carbon-containing treatment precursor comprises a carboxylic acid anhydride.

11 . The method of claim 7 , wherein the carbon-containing treatment precursor comprises an alcohol.

12 . The method of claim 7 , further comprising repeating the steps of providing the treatment reactant to the reaction chamber and depositing the threshold voltage tuning material overlying the treated surface to form the threshold voltage tuning layer.

13 . A method of forming a structure comprising a threshold voltage tuning layer, the method comprising:
providing a substrate comprising a substrate surface within a reaction chamber; and using a cyclical deposition process, depositing threshold voltage tuning material overlying the substrate surface, wherein the cyclical deposition process comprises: providing a metal deposition precursor to the reaction chamber; providing a silicon precursor to the reaction chamber; and providing an oxidant to the reaction chamber.

14 . The method of claim 13 , wherein the step of providing the metal deposition precursor comprises providing a carbon-free, halogen-containing metal precursor.

15 . The method of claim 14 , wherein the step of providing the silicon precursor comprises providing a carbon-free, halogen-containing silicon precursor.

16 . The method of claim 14 , wherein the threshold voltage tuning layer comprises one or more of silicon-doped niobium oxide and silicon-doped aluminum oxide.

17 . A method of forming a structure comprising a threshold voltage tuning layer, the method comprising:
providing a substrate comprising a substrate surface within a reaction chamber; depositing threshold voltage tuning material overlying the substrate surface; providing an etchant to the reaction chamber to form the threshold voltage tuning layer; and forming a metal oxide layer over the threshold voltage tuning layer.

18 . The method of claim 17 , wherein the etchant comprises a beta-diketonate compound.

19 . The method of claim 17 , further comprising a step of treating the surface of the substrate with a treatment reactant to inhibit growth of the threshold voltage tuning material.

20 . The method of claim 17 , wherein the threshold voltage tuning layer comprises one or more of a lanthanum oxide, an aluminum oxide, a gallium oxide, a zinc oxide, a silicon-doped niobium oxide, a silicon-doped aluminum oxide, a silicon-doped lanthanum oxide, a silicon-doped yttrium oxide, a silicon-doped scandium oxide, or a silicon-doped lutetium oxide.

Assignees

• Asm Ip Holding Bv

Inventors

• Dezelah Charles
• Givens Michael Eugene
• Liu Eric Jen Cheng
• Shero Eric James
• Tang Fu
• Tuominen Marko
• Tois Eva Elisabeth
• Illiberi Andrea
• Ivanova Tatiana
• Ma Paul
• Zhao Gejian

Classifications

• H10P50/283

  by chemical means · CPC title

• H10P14/6681

  the precursor containing a compound comprising Si · CPC title

• H10P14/6512 Primary

  by exposure to a gas or vapour · CPC title

• H10P14/6339

  deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD · CPC title

• H10P14/69391 Primary

  the material containing aluminium, e.g. Al2O3 · CPC title