Substrate processing device and substrate processing method

Patent metadata

Field	Value
Publication number	US-2024213075-A1
Application number	US-202318391278-A
Country	US
Kind code	A1
Filing date	Dec 20, 2023
Priority date	Dec 23, 2022
Publication date	Jun 27, 2024
Grant date	—

Abstract

A substrate is held by an upper holding device, and a lower-surface center region of the substrate is cleaned with use of a lower-surface brush. The substrate is lowered from an upper holding device and transferred to a suction holder of a lower holding device. The substrate held by the suction holder is cleaned with use of a processing liquid. A cup is provided to be liftable and lowerable between an upper cup position and a lower cup position. The cup is in the lower cup position when waiting. A period for the substrate lowering operation and a period for the cup lifting operation at least partially overlap with each other.

First claim

I/We claim:

1 . A substrate processing device comprising:
a first substrate holder configured to hold a substrate at a first height position; a second substrate holder configured to hold the substrate at a second height position lower than the first height position; a processor configured to perform first processing on the substrate held by the first substrate holder and performing second processing on the substrate held by the second substrate holder; a substrate mover that performs a substrate lowering operation of lowering the substrate from the first height position to the second height position for transfer of the substrate from the first substrate holder to the second substrate holder; and a controller, wherein the second processing includes processing with use of a processing liquid, the processor includes a processing cup formed to surround the second substrate holder in plan view and provided to be liftable and lowerable between an upper cup position corresponding to the second height position and a lower cup position lower than the upper cup position, and a cup driver that lifts and lowers the processing cup, and the controller, by controlling the substrate mover and the cup driver, causes the substrate lowering operation performed by the substrate mover and a cup lifting operation of lifting the processing cup from the lower cup position toward the upper cup position to be performed such that a period for the substrate lowering operation and a period for the cup lifting operation at least partially overlap with each other.

2 . A substrate processing device comprising:
a first substrate holder configured to hold a substrate at a first height position; a second substrate holder configured to hold the substrate at a second height position lower than the first height position; a processor configured to perform first processing on the substrate held by the first substrate holder and performing second processing on the substrate held by the second substrate holder; a substrate mover that performs a substrate lowering operation of lowering the substrate from the first height position to the second height position for transfer of the substrate from the first substrate holder to the second substrate holder; and a controller, wherein the processor includes a lower-surface brush that cleans a lower surface of the substrate by coming into contact with the lower surface, and a lower-surface brush mover configured to move the lower-surface brush between a lower-surface brush processing position at which the lower-surface brush comes into contact with the lower surface of the substrate held by the second substrate holder and a lower-surface brush waiting position spaced apart from the lower-surface brush processing position, the second processing includes cleaning processing for the lower surface of the substrate by the lower-surface brush, and the controller, by controlling the substrate mover and the lower-surface brush mover, causes the substrate lowering operation performed by the substrate mover and a lower-surface brush preparing operation of moving the lower-surface brush from the lower-surface brush waiting position to the lower-surface brush processing position to be performed such that a period for the substrate lowering operation and a period for the lower-surface brush preparing operation at least partially overlap with each other.

3 . A substrate processing device comprising:
a first substrate holder configured to hold a substrate at a first height position; a second substrate holder configured to hold the substrate at a second height position lower than the first height position; a processor configured to perform first processing on the substrate held by the first substrate holder and performing second processing on the substrate held by the second substrate holder; a substrate mover that performs a substrate lowering operation of lowering the substrate from the first height position to the second height position for transfer of the substrate from the first substrate holder to the second substrate holder; and a controller, wherein the processor includes a fluid nozzle that discharges fluid including a processing liquid to an upper surface of the substrate, and a nozzle mover configured to move the fluid nozzle between a nozzle processing position above the substrate held by the second substrate holder and a nozzle waiting position sidewardly spaced apart from the substrate held by the second substrate holder, the second processing includes cleaning processing for the upper surface of the substrate performed by the fluid nozzle, and the controller, by controlling the substrate mover and the nozzle mover, causes the substrate lowering operation performed by the substrate mover and a nozzle preparing operation of moving the fluid nozzle from the nozzle waiting position to the nozzle processing position to be performed such that a period for the substrate lowering operation and a period for the nozzle preparing operation at least partially overlap with each other.

4 . A substrate processing device comprising:
a first substrate holder configured to hold a substrate at a first height position; a second substrate holder configured to hold the substrate at a second height position lower than the first height position; a processor configured to perform first processing on the substrate held by the first substrate holder and performing second processing on the substrate held by the second substrate holder; a substrate mover that performs a substrate lowering operation of lowering the substrate from the first height position to the second height position for transfer of the substrate from the first substrate holder to the second substrate holder; and a controller, wherein the processor includes an end-portion brush that cleans an outer peripheral end of the substrate by coming into contact with the outer peripheral end, and an end-portion brush mover configured to move the end-portion brush between an end-portion brush processing position at which the end-portion brush comes into contact with the outer peripheral end of the substrate held by the second substrate holder and an end-portion brush waiting position sidewardly spaced apart from the substrate held by the second substrate holder, the second processing includes cleaning processing for the outer peripheral end of the substrate performed by the end-portion brush, and the controller, by controlling the substrate mover and the end-portion brush mover, causes the substrate lowering operation performed by the substrate mover and an end-portion brush preparing operation of moving the end-portion brush from the end-portion brush waiting position to the end-portion brush processing position to be performed such that a period for the substrate lowering operation and a period for the brush preparing operation at least partially overlap with each other.

5 . The substrate processing device according to claim 1 , wherein
the processor includes a lower-surface brush that cleans a lower surface of the substrate by coming into contact with the lower surface, and a lower-surface brush mover configured to move the lower-surface brush between a lower-surface brush processing position at which the lower-surface brush comes into contact with the lower-surface of the substrate held by the second substrate holder and a lower-surface brush waiting position spaced apart from the lower-surface brush processing position; a fluid nozzle that discharges fluid including a processing liquid to an upper surface of the substrate; a nozzle mover configured to move the fluid nozzle between a nozzle processing position above the substrate held by the second substrate holder and a nozzle waiting position spaced apart from the substrat

Assignees

• Screen Holdings Co Ltd

Inventors

• Okada Yoshifumi
• Okita Nobuaki
• Nakamura Kazuki

Classifications

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0412 Primary

  using mainly scrubbing means, e.g. brushes · CPC title