Engineered materials for electronics assembly

Patent metadata

Field	Value
Publication number	US-2024198460-A1
Application number	US-202218555829-A
Country	US
Kind code	A1
Filing date	Apr 14, 2022
Priority date	Apr 21, 2021
Publication date	Jun 20, 2024
Grant date	—

Abstract

A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

First claim

1 - 48 . (canceled)

49 . A solder material for use in electronic assembly, the solder material comprising:
solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers,
wherein:
the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

50 . The solder material of claim 49 , wherein the thickness of each solder layer is from greater than 50 to 99 μm, preferably from 55 to 95 μm, more preferably from 60 to 90 μm.

51 . The solder material of claim 49 , wherein the solder comprises one or both of SnSb alloy (e.g. 95% Sn, 5% Sb) or Innolot alloy (Sn—Ag3.7Cu0.65Bi3.0Sb1.43Ni0.15).

52 . The solder material of claim 49 , wherein:
the thickness of the core layer is from 150 to 300 μm, the thickness of each solder layer is from greater than 50 to 100 μm, preferably from 55 to 100 μm, and the core material comprises one or more of copper and silver.

53 . The solder material of claim 49 , wherein the core layer comprises two or more core sublayers separated by one or more further solder layers, the two or more core sublayers formed of core material, the core material of one sublayer having a different coefficient of thermal expansion to the core material of another sublayer.

54 . The solder material of claim 53 , wherein the core material of one core sublayer is different from the core material of another core sublayer.

55 . The solder material of claim 53 , comprising two sublayers.

56 . The solder material of claim 55 , wherein the core material of one core sublayer comprises copper and the core material of the other core sublayer comprises nickel.

57 . The solder material of claim 53 , comprising three sublayers.

58 . The solder material of claim 57 , wherein the coefficients of thermal expansion of the core materials of the core sublayers increase across the thickness of the solder material.

59 . The solder material of claim 57 , wherein the three sublayers comprise an inner sublayer and two outer sublayers, core material of one core sublayer comprises copper, the core material of another core sublayer comprises nickel and the core material of another core sublayer comprises copper-tungsten alloy.

60 . The solder material of claim 57 , wherein the core material of one core sublayer comprises silver, the core material of another core sublayer comprises nickel and the core material of another core sublayer comprises molybdenum.

61 . The solder material of claim 49 , wherein:
the solder material is not in the form of a cuboid having a length, a width and a thickness, the thickness being perpendicular to the plane of the core layer, the length being 10 mm and the width being 10 mm; and/or the thickness of the core layer is not 0.2 mm, 0.3 mm or 0.4 mm; and/or the solder layers do not each have a thickness of 0.05 or 0.1 mm; and/or the solder material does not comprise Sn20% In2% Ag; and/or the core material does not comprise copper.

62 . A multilayered structure for use in electronic assembly, the multilayered structure comprising:
two outer solder layers, each outer solder later comprising solder material; and a core layer sandwiched between the two outer solder layers,
wherein:
the core layer comprises two outer core sublayers and optionally one or more central core sublayers:
the two core sublayers, and central core layers if present, being separated from each other by one or more solder layers:
the outer core sublayers and inner core sublayers comprise core material:
the core material of one outer core sublayer has a different coefficient of thermal expansion than the core material of the other outer core sublayer: and
the thermal conductivity of the core materials is greater than the thermal conductivity of the solder materials.

63 . The multilayered structure of claim 62 , wherein the core comprises at least one central core sublayers and the coefficient of thermal expansion of the core materials of the outer and inner core sublayers increases across the thickness of the core.

64 . A method of forming a solder joint comprising:
providing the solder material of claim 49 ; or,
a multilayered structure for use in electronic assembly, the multilayered structure comprising:
two outer solder layers, each outer solder later comprising solder material; and
a core layer sandwiched between the two outer solder layers,
wherein:
the core layer comprises two outer core sublayers and optionally one or more central core sublayers:
the two core sublayers, and central core layers if present, being separated from each other by one or more solder layers:
the outer core sublayers and inner core sublayers comprise core material:
the core material of one outer core sublayer has a different coefficient of thermal expansion than the core material of the other outer core sublayer: and
the thermal conductivity of the core materials is greater than the thermal conductivity of the solder materials, the multilayered structure in the vicinity of two or more work pieces to be joined, and

heating the solder material to form a soldered joint.

65 . The method of claim 64 , wherein:
the two or more work pieces to be joined comprise at least three work pieces, the work pieces have different thicknesses, different solder materials are used to join different work pieces, and the thicknesses of the solder materials are adjusted to reduce a mismatch in coefficient of thermal expansion between the work pieces.

66 . The method of claim 64 , wherein:
the core layer comprises two or more core sublayers separated by one or more further solder layers, the two or more core sublayers formed of core material, the core material of one sublayer having a different coefficient of thermal expansion to the core material of another sublayer, the sublayers arranged such that the coefficient of thermal expansion of the core material of the sublayers increases across the thickness of the solder material to provide a side having a higher coefficient of thermal expansion and a side having a lower coefficient of thermal expansion; the two or more work pieces to be joined have contact materials having different coefficients of thermal expansion; and the solder material is placed between the two or more work pieces, with the work piece having the contact material with the lower coefficient of thermal expansion in contact with the side having a lower coefficient of thermal expansion and the work piece having contact material with the higher coefficient of thermal expansion in contact with the side having a higher coefficient of thermal expansion.

67 . The method of claim 64 , further comprising:
providing an additional layer of core material; laminating the additional layer of core material on a layer of solder; providing an additional layer of solder; and laminating the additional layer of solder on the additional layer of core material.

68 . The method of claim 67 , further comprising:
providing another additional layer of core material; laminating the another additional layer of core material on a layer of solder or a layer of additional solder; providing another additional layer of solder; and laminating the additional layer of solder on the another additional layer of core material.

Assignees

• Alpha Assembly Solutions Inc

Inventors

• Pandher Ranjit
• Nagarajan Niveditha
• Sidone Girard
• Bilgrien Carl

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/345

  of outermost layers of multilayered die-attach connectors, e.g. coating being only on a part of a core · CPC title

• H10W72/322

  Multilayered die-attach connectors, e.g. a coating on a top surface of a core · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title