Sensor device and method for manufacturing sensor device
US-2024387437-A1 · Nov 21, 2024 · US
of outermost layers of multilayered die-attach connectors, e.g. coating being only on a part of a core
of outermost layers of multilayered die-attach connectors, e.g. coating being only on a part of a core · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/345 |
| Official title | {of outermost layers of multilayered die-attach connectors, e.g. coating being only on a part of a core} |
| Display label | of outermost layers of multilayered die-attach connectors, e.g. coating being only on a part of a core |
| Total patents | 67 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 7 |
| 2017 | 9 |
| 2018 | 4 |
| 2019 | 5 |
| 2021 | 4 |
| 2022 | 10 |
| 2023 | 7 |
| 2024 | 10 |
| 2025 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Energy augmentation structures, energy emitters or energy collectors containing the same, and their use in methods and systems for treating cell proliferation disorders
US-12121746-B2 · Oct 22, 2024 · US
Electronic device and method for manufacturing electronic device
US-12087721-B2 · Sep 10, 2024 · US
Energy augmentation structures in adhesive bonding compositions
US-12076579-B2 · Sep 3, 2024 · US
Engineered materials for electronics assembly
US-2024198460-A1 · Jun 20, 2024 · US
Energy augmentation structures and their use in solar cells and other energy conversion devices
US-11998760-B2 · Jun 4, 2024 · US
Energy augmentation structures, and their use in adhesive bonding
US-11964166-B2 · Apr 23, 2024 · US
Energy augmentation structures for use with energy emitters and collectors
US-11964167-B2 · Apr 23, 2024 · US
Energy augmentation structures, energy emitters or energy collectors containing the same, and their use in solar cells and other energy conversion devices
US-2024115878-A1 · Apr 11, 2024 · US
Bonding structure and semiconductor device having the bonding structure
US-2023395551-A1 · Dec 7, 2023 · US
Semiconductor device
US-2023387062-A1 · Nov 30, 2023 · US
Liquid phase bonding for electrical interconnects in semiconductor packages
US-2023369277-A1 · Nov 16, 2023 · US
Layered bonding material, semiconductor package, and power module
US-11712760-B2 · Aug 1, 2023 · US
Engineered materials for electronics assembly
US-2023146579-A1 · May 11, 2023 · US
Metal jointed body, semiconductor device, wave guide tube, and method for joining members to be joined
US-2023054798-A1 · Feb 23, 2023 · US
Layered bonding material, semiconductor package, and power module
US-2023039027-A1 · Feb 9, 2023 · US
Energy augmentation structures, and their use in adhesive bonding
US-2022315809-A1 · Oct 6, 2022 · US
Multi-layer sheet for mold underfill encapsulation, method for mold underfill encapsulation, electronic component mounting substrate, and production method for electronic component
US-2022310546-A1 · Sep 29, 2022 · US
Energy augment structures for use with energy emitters and collectors
US-2022275914-A1 · Sep 1, 2022 · US
Electronic device and method for manufacturing electronic device
US-2022254748-A1 · Aug 11, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/345?
- CPC H10W72/345 is the Cooperative Patent Classification code for “of outermost layers of multilayered die-attach connectors, e.g. coating being only on a part of a core.”
- How many patents are filed under CPC H10W72/345 (of outermost layers of multilayered die-attach connectors, e.g. coating being only on a part of a core)?
- Our database includes 67 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/345 growing?
- Publication counts under this code: 10 in 2024 vs 6 in 2025 (latest complete years).