Energy augmentation structures, energy emitters or energy collectors containing the same, and their use in solar cells and other energy conversion devices
US-2024115878-A1 · Apr 11, 2024 · US
Multilayered die-attach connectors, e.g. a coating on a top surface of a core
Multilayered die-attach connectors, e.g. a coating on a top surface of a core · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/322 |
| Official title | {Multilayered die-attach connectors, e.g. a coating on a top surface of a core} |
| Display label | Multilayered die-attach connectors, e.g. a coating on a top surface of a core |
| Total patents | 962 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 79 |
| 2016 | 81 |
| 2017 | 105 |
| 2018 | 70 |
| 2019 | 111 |
| 2020 | 126 |
| 2021 | 71 |
| 2022 | 85 |
| 2023 | 67 |
| 2024 | 79 |
| 2025 | 69 |
| 2026 | 19 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Pre-applied underfill
US-2015371916-A1 · Dec 24, 2015 · US
Eutectic solder structure for chip
US-9214443-B2 · Dec 15, 2015 · US
Chip device packages and fabrication methods thereof
US-9196571-B2 · Nov 24, 2015 · US
Semiconductor device and method for manufacturing the same
US-2015333024-A1 · Nov 19, 2015 · US
Connection method, connection structure, insulating adhesive member, electronic component having adhesive member, and method for manufacturing same
US-9190381-B2 · Nov 17, 2015 · US
Semiconductor device
US-9171817-B2 · Oct 27, 2015 · US
Semiconductor package
US-9171819-B2 · Oct 27, 2015 · US
Method for ternary wafer bonding and structure thereof
US-2015294950-A1 · Oct 15, 2015 · US
Semiconductor device
US-2015294928-A1 · Oct 15, 2015 · US
Mounting method
US-2015287696-A1 · Oct 8, 2015 · US
Integrated circuit chip assembled on an interposer
US-2015270192-A1 · Sep 24, 2015 · US
Anisotropic conductive film and method of producing the same
US-2015271918-A1 · Sep 24, 2015 · US
Semiconductor module package and method of manufacturing the same
US-2015270207-A1 · Sep 24, 2015 · US
Method for bonding wafers and structure of bonding part
US-9136232-B2 · Sep 15, 2015 · US
Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device
US-2015255419-A1 · Sep 10, 2015 · US
Power semiconductor module and method for operating a power semiconductor module
US-9129934-B2 · Sep 8, 2015 · US
Mixed alloy solder paste
US-2015246417-A1 · Sep 3, 2015 · US
Method of producing anisotropic conductive film and anisotropic conductive film
US-2015231803-A1 · Aug 20, 2015 · US
Advanced device assembly structures and methods
US-2015231732-A1 · Aug 20, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/322?
- CPC H10W72/322 is the Cooperative Patent Classification code for “Multilayered die-attach connectors, e.g. a coating on a top surface of a core.”
- How many patents are filed under CPC H10W72/322 (Multilayered die-attach connectors, e.g. a coating on a top surface of a core)?
- Our database includes 962 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/322 growing?
- Publication counts under this code: 79 in 2024 vs 69 in 2025 (latest complete years).