Core structure of inductor element and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2024145155-A1
Application number	US-202318499111-A
Country	US
Kind code	A1
Filing date	Oct 31, 2023
Priority date	Nov 2, 2022
Publication date	May 2, 2024
Grant date	—

Abstract

Provided is a core structure of an inductor element. The manufacturing method thereof is to embed a magnetic conductor including at least one magnetic conductive layer in a core body and to from a plurality of apertures for passing coils around the magnetic conductor in the core body. Accordingly, the magnetic conductor is designed in the core body by using the integrated circuit carrier board manufacturing process, such that the overall size and thickness of the inductor element can be greatly reduced, thereby facilitating product miniaturization using the inductor element.

First claim

What is claimed is:

1 . A core structure of an inductor element, the core structure comprising:
a core body having a first side and a second side opposing the first side and a first aperture and a second aperture communicating with the first side and the second side; and a magnetic conductor embedded in the core body and configured with respect to the first aperture and the second aperture of the core body, wherein the first aperture and the second aperture of the core body are formed on opposite sides of the magnetic conductor, wherein the magnetic conductor includes at least one magnetic conductive layer.

2 . The core structure of claim 1 , wherein a material forming the core body is a photosensitive or non-photosensitive insulating material and includes Ajinomoto Build-up Film, photosensitive compound, polyimide, bismaleimide triazine, flame resistant 5 prepreg material, molding compound, or epoxy molding compound.

3 . The core structure of claim 1 , wherein the magnetic conductor contains at least one of iron, nickel, cobalt, manganese, zinc or a combination thereof, or an alloy material of a combination thereof, including nickel/iron alloy, cobalt/nickel/iron alloy or zinc/nickel alloy.

4 . The core structure of claim 1 , wherein the magnetic conductive layer is in a shape of a plane plate.

5 . The core structure of claim 1 , wherein the magnetic conductor further comprises a pattern layer formed on the magnetic conductive layer, and the pattern layer comprises teeth, triangles, cylinders or a combination of other shapes and is continuous, segmented or a combination thereof.

6 . The core structure of claim 1 , wherein a top view shape of the magnetic conductive layer is a rectangular structure, a ring structure or a structure with a plurality of parallel slots in a rectangular outline.

7 . The core structure of claim 1 , wherein the core body further has at least one third aperture communicating with the first side and the second side, and the magnetic conductor is formed around the third aperture of the core body.

8 . A method of manufacturing a core structure of an inductor element, the method comprising:
forming a first insulating layer on a carrier; forming a magnetic conductive layer on the first insulating layer, wherein the magnetic conductive layer acts as a magnetic conductor; forming a second insulating layer on the first insulating layer to cover the magnetic conductive layer, wherein the first insulating layer and the second insulating layer serve as a core body, and the core body has a first side and a second side opposing the first side; removing the carrier to expose the first side of the core body; and forming a first aperture and a second aperture penetrating through the core body, wherein the first aperture and the second aperture communicate with the first side and the second side of the core body, wherein the magnetic conductor is configured with respect to the first aperture and the second aperture of the core body, and the first aperture and the second aperture of the core body are formed on opposite sides of the magnetic conductor.

9 . The method of claim 8 , wherein the magnetic conductive layer is formed by electroplating, sputtering or physical vapor deposition.

10 . The method of claim 8 , further comprising forming another magnetic conductive layer on the second insulating layer and subsequently forming a third insulating layer on the second insulating layer to cover the another magnetic conductive layer, wherein the core body comprises the third insulating layer, and the magnetic conductor comprises the another magnetic conductive layer.

11 . The method of claim 8 , wherein a material forming the core body is a photosensitive or non-photosensitive insulating material and includes Ajinomoto Build-up Film, photosensitive compound, polyimide, bismaleimide triazine, flame resistant 5 prepreg material, molding compound, or epoxy molding compound.

12 . The method of claim 8 , wherein the magnetic conductor contains at least one of iron, nickel, cobalt, manganese, zinc or a combination thereof, or an alloy material of a combination thereof, including nickel/iron alloy, cobalt/nickel/iron alloy or zinc/nickel alloy.

13 . The method of claim 8 , wherein the magnetic conductive layer is in a shape of a plane plate.

14 . The method of claim 8 , further comprising forming a pattern layer on the magnetic conductive layer, wherein the magnetic conductive layer and the pattern layer are covered by the second insulating layer.

15 . The method of claim 8 , wherein a top view shape of the magnetic conductive layer is a rectangular structure, a ring structure or a structure with a plurality of parallel slots in a rectangular outline.

16 . The method of claim 8 , wherein the core body is formed with at least one third aperture communicating with the first side and the second side, and the magnetic conductor is formed around the third aperture of the core body.

Assignees

• Phoenix Pioneer Technology Co Ltd

Inventors

• Chou Pao-Hung
• Hsu Che-Wei
• Hsu Shih-Ping

Classifications

• H10W44/501

  Inductive arrangements (H10W44/20 takes precedence) · CPC title

• H10D1/20

  Inductors · CPC title

• H01F41/34

  in patterns, e.g. by lithography · CPC title

• H01F2027/348

  Preventing eddy currents · CPC title

• H01F2017/002

  Details of via holes for interconnecting the layers · CPC title