Substrate processing device, polishing device, and substrate processing method

Patent metadata

Field	Value
Publication number	US-2024139782-A1
Application number	US-202318490727-A
Country	US
Kind code	A1
Filing date	Oct 19, 2023
Priority date	Oct 31, 2022
Publication date	May 2, 2024
Grant date	—

Abstract

Provided are a substrate processing device, a polishing device, and a substrate processing method. The substrate processing device includes a processing module for processing the substrate with a liquid, and a gas-liquid separation tank connected to the exhaust outlet of the processing module, which separates the liquid from the exhaust received from the processing module and releases the exhaust into an exhaust duct. The gas-liquid separation tank includes a tank body, a heat exchanger arranged inside the tank body and cools the exhaust, and an air nozzle arranged inside the tank body and supplies air to cool the exhaust.

First claim

What is claimed is:

1 . A substrate processing device, comprising:
a processing module for processing a substrate with a liquid, and a gas-liquid separation tank connected to an exhaust outlet of the processing module, separating the liquid from an exhaust received from the processing module, and releasing the exhaust to an exhaust duct, wherein the gas-liquid separation tank comprises: a tank body; a heat exchanger arranged in the tank body and cooling the exhaust, and an air nozzle arranged in the tank body and supplying air for cooling the exhaust.

2 . The substrate processing device according to claim 1 ,
wherein the processing module processes the substrate using a heated liquid.

3 . The substrate processing device according to claim 1 ,
wherein the heat exchanger has a tube through which a cooled liquid flows.

4 . The substrate processing device according to claim 3 ,
wherein the tube is a bellows tube.

5 . The substrate processing device according to claim 1 , further comprising:
an air cooler connected to the nozzle, wherein the air cooler receives supply of air and outputs cooled air to the nozzle.

6 . The substrate processing device according to claim 5 ,
wherein the air cooler is a vortex tube.

7 . The substrate processing device according to claim 1 ,
wherein the air is compressed air.

8 . The substrate processing device according to claim 1 ,
wherein a direction of discharge of the air from the nozzle is directed towards the heat exchanger.

9 . The substrate processing device according to claim 1 ,
wherein the nozzle has a cylindrical body with multiple holes provided on a side surface.

10 . The substrate processing device according to claim 1 ,
wherein multiple holes are provided over entire circumference or a partial range of a side surface in a circumferential direction.

11 . The substrate processing device according to claim 1 ,
wherein the gas-liquid separation tank further comprises a baffle plate that redirects a direction of flow of exhaust from the processing module.

12 . The substrate processing device according to claim 1 ,
wherein the heat exchanger is arranged on an upstream side of a baffle plate in the tank body, and the air nozzle is arranged on a downstream side of the baffle plate in the tank body.

13 . The substrate processing device according to claim 1 ,
wherein the heat exchanger has a baffle plate with a passage through which a cooled liquid flows.

14 . The substrate processing device according to claim 12 ,
wherein the heat exchanger further has a tube through which a cooled liquid flows, apart from the baffle plate.

15 . The substrate processing device according to claim 1 , further comprising:
a waste liquid line connected to the tank body of the gas-liquid separation tank; a valve provided on the waste liquid line; a liquid level sensor that detects height of a liquid level of the liquid accumulated in the tank body of the gas-liquid separation tank; and a control device that opens the valve in response to detecting that the height of the liquid level has reached a predetermined height based on an output of the liquid level sensor.

16 . The substrate processing device according to claim 15 ,
wherein a bottom surface of the tank body has a first bottom surface portion with a first height, a second bottom surface portion with a second height, which is lower than the first height, located on a downstream side of the exhaust from the first bottom surface portion, and a sloping surface connecting the first bottom surface portion and the second bottom surface portion, and the waste liquid line is connected to the second bottom surface portion.

17 . The substrate processing device according to claim 1 , further comprising:
an exhaust duct attached to a side surface of the processing module, wherein the gas-liquid separation tank is attached to a bottom surface of the processing module so as to fluidly communicate with the processing module and the exhaust duct.

18 . The substrate processing device according to claim 1 ,
wherein the processing module is a cleaning module, and the substrate processing device is a substrate cleaning device.

19 . A polishing device, comprising:
the substrate processing device according to claim 15 .

20 . A substrate processing method, comprising:
processing a substrate with a liquid in a processing module; introducing exhaust from the processing module into a gas-liquid separation tank; in the gas-liquid separation tank, contacting the exhaust with a heat exchanger and air from an air nozzle so as to separate liquid from the exhaust and reduce temperature and humidity of the exhaust; and releasing the exhaust that has passed through the gas-liquid separation tank into an exhaust duct.

Assignees

• Ebara Corp

Inventors

• Sato Kohei
• Fukaya Koichi
• Takahashi Hiroki
• Kondo Daichi

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P72/0412 Primary

  using mainly scrubbing means, e.g. brushes · CPC title

• F16K31/06

  using a magnet {, e.g. diaphragm valves, cutting off by means of a liquid} · CPC title

• F16L9/06

  Corrugated pipes · CPC title