Substrate processing device, polishing device, and substrate processing method
US-12569891-B2 · Mar 10, 2026 · US
Kondo Daichi is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kondo Daichi |
| Total patents | 10 |
| First publication | Oct 6, 2022 |
| Latest publication | Mar 10, 2026 |
Publications ranked by popularity score, then publication date.
US-12569891-B2 · Mar 10, 2026 · US
US-2025125172-A1 · Apr 17, 2025 · US
US-2025001472-A1 · Jan 2, 2025 · US
US-12128449-B2 · Oct 29, 2024 · US
US-2024269720-A1 · Aug 15, 2024 · US
US-2024139782-A1 · May 2, 2024 · US
US-2024082987-A1 · Mar 14, 2024 · US
US-2023390898-A1 · Dec 7, 2023 · US
US-2022395874-A1 · Dec 15, 2022 · US
US-2022317084-A1 · Oct 6, 2022 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ebara Corp | 9 |
| Ngk Insulators Ltd | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0412 | 5 |
| B08B13/00 | 5 |
| H10P72/0604 | 4 |
| B08B3/02 | 4 |
| B24B49/00 | 4 |