Method for setting up test apparatus and test apparatus

Patent metadata

Field	Value
Publication number	US-2024118338-A1
Application number	US-202218264319-A
Country	US
Kind code	A1
Filing date	Feb 7, 2022
Priority date	Feb 18, 2021
Publication date	Apr 11, 2024
Grant date	—

Abstract

One aspect of the present disclosure relates to a method of setting up a test apparatus that is a method of setting up the test apparatus to test a substrate by bringing a probe into contact with an electrode pad formed on a chip on the substrate that is mounted on a stage. The method includes acquiring a first image including the probe in a probe card that is attached to the test apparatus. The method includes calculating first information including a center of gravity, and an angle, for the probe card, based on probe information including a position of the probe that is calculated based on the first image; and probe information or pad information that is pre-provisioned and corresponds to the probe card. The method includes acquiring a second image including the electrode pad on the substrate mounted on the stage. The method includes calculating second information including a center of gravity of the chip and an angle for the substrate, based on pad information that includes a position of the electrode pad and is calculated based on the second image; and pad information that is pre-provisioned and corresponds to the substrate. The method includes outputting the first information and the second information.

First claim

1 . A method of setting up a test apparatus to test a substrate by bringing a probe into contact with an electrode pad formed on a chip on the substrate that is mounted on a stage, the method comprising:
acquiring a first image including the probe in a probe card that is attached to the test apparatus; calculating first information including a center of gravity, and an angle, for the probe card, based on
probe information including a position of the probe that is calculated based on the first image, and
probe information or pad information that is pre-provisioned and corresponds to the probe card;
acquiring a second image including the electrode pad on the substrate mounted on the stage; and calculating second information including a center of gravity of the chip and an angle for the substrate, based on
pad information that includes a position of the electrode pad and is calculated based on the second image, and
pad information that is pre-provisioned and corresponds to the substrate; and
outputting the first information and the second information.

2 . The method of setting up a test apparatus according to claim 1 , wherein each probe information includes at least one of a distance from a center of the probe card or an attribute of a reference pin.

3 . The method of setting up a test apparatus according to claim 1 , wherein each pad information includes at least one of a pad shape, a pad size, a distance from a center of a chip, or an attribute of a reference pad.

4 . The method of setting up a test apparatus according to claim 1 , wherein the first information includes a degree of match between the probe information including the position of the probe that is calculated based on the first image, and the probe information or the pad information that is pre-provisioned and corresponds to the probe card.

5 . The method of setting up a test apparatus according to claim 1 , wherein the second information includes a degree of match between the pad information including the position of the electrode pad that is calculated based on the second image, and the pad information that is pre-provisioned and corresponds to the substrate.

6 . The method of setting up a test apparatus according to claim 1 , wherein the second information includes a positional relationship between a center of the substrate and a center of gravity of the chip on the substrate.

7 . A test apparatus for testing a substrate by bringing a probe into contact with an electrode pad that is formed on a chip on the substrate, the test apparatus comprising:
a stage on which the substrate is to be mounted; a probe card including a probe that is to contact the electrode pad; a controller, the controller being configured to cause
acquiring of a first image including the probe in a probe card that is attached to the test apparatus;
calculating of first information including a center of gravity, and an angle, for the probe card, based on
probe information including a position of the probe that is calculated based on the first image, and
probe information or pad information that is pre-provisioned and corresponds to the probe card;

acquiring of a second image including the electrode pad on the substrate mounted on the stage; and
calculating of second information including a center of gravity of the chip and an angle for the substrate, based on
pad information that includes a position of the electrode pad and is calculated based on the second image, and
pad information that is pre-provisioned and corresponds to the substrate; and

outputting of the first information and the second information.

Assignees

• Tokyo Electron Ltd

Inventors

• Watanabe Shinjiro

Classifications

• H10P74/00

  Testing or measuring during manufacture or treatment of wafers, substrates or devices · CPC title

• G01R1/07342

  the body of the probe being at an angle other than perpendicular to test object, e.g. probe card · CPC title

• G01R31/2891 Primary

  related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05) · CPC title

• G01R31/2887

  involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392) · CPC title

• G01R1/07314

  the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support (on an elastic support, e.g. a film, G01R1/0735) · CPC title