Polishing head system and polishing method

Patent metadata

Field	Value
Publication number	US-2024066658-A1
Application number	US-202318237263-A
Country	US
Kind code	A1
Filing date	Aug 23, 2023
Priority date	Aug 31, 2022
Publication date	Feb 29, 2024
Grant date	—

Abstract

A polishing-head system capable of precisely controlling a polishing rate for a substrate, such as a wafer, and more particularly a polishing rate at an edge portion is disclosed. The polishing-head system includes a polishing head, a head shaft, a head rotating mechanism, a multi-path rotary joint, a fluid supply line, and a pressure regulator, wherein the polishing head has a substrate pressing surface, a retainer ring, and pressure chambers arranged along a circumferential direction of the retainer ring, the head shaft has shaft flow-passages communicating with the pressure chambers, respectively, and the multi-path rotary joint is configured to sequentially provide a communication between the fluid supply line and the shall flow-passages each time the head shaft makes one revolution.

First claim

1 . A polishing-head system comprising:
a polishing head configured to press a substrate against a polishing surface; a head shaft coupled to the polishing head; a head rotating mechanism configured to rotate the polishing head together with the head shaft; a multi-path rotary joint arranged around at least a part of the head shaft; a fluid supply line coupled to the multi-path rotary joint; and a pressure regulator attached to the fluid supply line, wherein the polishing head has:
a substrate pressing surface configured to press the substrate against the polishing surface;
a retainer ring arranged around the substrate pressing surface; and
pressure chambers formed by elastic material and configured to generate pressing forces for pressing the retainer ring against the polishing surface,
the head shaft has shaft flow-passages communicating with the pressure chambers, respectively, the multi-path rotary joint is configured to provide a communication between the fluid supply line and each one of the shaft flow-passages successively each time the head shaft makes one revolution, and the pressure chambers are arranged along a circumferential direction of the retainer ring.

2 . The polishing-head system according to claim 1 , wherein
the shaft flow-passages have shaft openings being open in an outer surface of the head shaft, the multi-path rotary joint has a joint flow-passage communicating with the fluid supply line, the joint flow-passage has a joint opening being open in an inner surface of the multi-path rotary joint, the shaft openings are arranged along a circumferential direction of the head shaft, and the shaft openings and the joint opening are located at the same position in an axial direction of the head shaft.

3 . The polishing-head system according to claim 2 , wherein
the fluid supply line comprises fluid supply lines, the pressure regulator comprises pressure regulators attached to the fluid supply lines, respectively, the joint flow-passage comprises joint flow-passages communicating with the fluid supply lines, respectively, and the joint opening comprises joint openings arranged along the circumferential direction of the head shaft.

4 . The polishing-head system according to claim 24 , wherein
the multi-path rotary joint has:
a joint member arranged along a circumferential direction of the head shaft;
a joint holder arranged around the joint member; and
a spring configured to press the joint member against the head shaft, and
the joint flow-passage extends through the joint member and the joint holder.

5 . The polishing-head system according to claim 4 , wherein the multi-path rotary joint has a positioning mechanism configured to fix a relative position of the joint member with respect to the joint holder in a circumferential direction of the joint member.

6 . The polishing-head system according to claim 1 , wherein
the pressure chambers comprise pressure chamber groups, the pressure chamber groups communicate with the shaft flow-passages, respectively, and each of the pressure chamber groups includes pressure chambers formed by rolling diaphragms, the rolling diaphragms being arranged along the circumferential direction of the retainer ring.

7 . The polishing-head system according to claim 6 , wherein each of the rolling diaphragms has a cylindrical shape.

8 . The polishing-head system according to claim 1 , wherein the polishing head further includes an annular pressure chamber located adjacent to the pressure chambers.

9 . The polishing-head system according to claim 2 , wherein a width of the joint opening is larger than a width of each of the shaft openings.

10 . The polishing-head system according to claim 1 , further comprising an operation controller configured to control an operation of the pressure regulator,
wherein the pressure chambers include a first pressure chamber, the operation controller is configured to transmit a correcting set-pressure-value, which is larger than a set pressure value of fluid in the fluid supply line, to cause the pressure regulator to correct a pressure in the first pressure chamber when the pressure in the first pressure chamber is smaller than a target value.

11 . The polishing-head system according to claim 10 , wherein the operation controller is configured to determine the correcting set-pressure-value that minimizes a difference between an integral value of the pressure in the first pressure chamber during one revolution of the polishing head and an integral value of the target pressure during one revolution of the polishing head.

12 . The polishing-head system according to claim 10 , further comprising a pressure sensor configured to measure the pressure in the first pressure chamber,
wherein the operation controller is configured to determine the correcting set-pressure-value that minimizes a difference between the pressure in the first pressure chamber measured by the pressure sensor and the target pressure.

13 . The polishing-head system according to claim 10 , wherein the operation controller is configured to determine the correcting set-pressure-value that minimizes a difference between the pressure in the first pressure chamber and the target pressure based on a correlation, which is obtained in advance, between the set pressure value and the pressure in the first pressure chamber.

14 . A polishing method for a substrate with the polishing-head system according to claim 1 , comprising:
pressing the substrate against the polishing surface while rotating the substrate to polish the substrate; and during polishing of the substrate, applying pressing forces to the retainer ring to press the retainer ring against the polishing surface by supplying fluid into the pressure chambers through the fluid supply line while providing a communication between the fluid supply line and each one of the shaft flow-passages successively, wherein the pressing forces include at least two different pressing forces.

15 . The polishing method according to claim 14 , wherein
polishing of the substrate is performed while rotating the polishing surface, and the polishing method comprises regulating pressures in the pressure chambers by the pressure regulator such that a pressing force generated by a pressure chamber, which is one of the pressure chambers, located at a downstream side in a rotating direction of the polishing surface is larger than a pressing force generated by other pressure chamber.

16 . The polishing method according to claim 14 , further comprising causing the pressure regulator to correct a pressure in a first pressure chamber of the pressure chambers based on a correcting set-pressure-value, which is larger than a set pressure value of the fluid in the fluid supply line, when the pressure in the first pressure chamber is smaller than a target pressure.

17 . The polishing method according to claim 16 , further comprising determining the correcting set-pressure-value that minimizes a difference between an integral value of the pressure in the first pressure chamber during one revolution of the polishing head and an integral value of the target pressure during one revolution of the polishing head.

18 . The polishing method according to claim 16 , further comprising:
measuring the pressure in the first pressure chamber; and determining the correcting set-pressure-value that minimizes a difference between the pressure in the first pressure chamber measured by the pressure sensor and the target pressure.

Assignees

• Ebara Corp

Inventors

• Nabeya Osamu

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B24B37/005 Primary

  Control means for lapping machines or devices · CPC title

• B24B37/042 Primary

  operating processes therefor · CPC title

• B24B37/32 Primary

  Retaining rings · CPC title

• B24B49/16

  taking regard of the load · CPC title