Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-2024066561-A1
Application number	US-202218261578-A
Country	US
Kind code	A1
Filing date	Jan 5, 2022
Priority date	Jan 19, 2021
Publication date	Feb 29, 2024
Grant date	—

Abstract

A substrate processing apparatus includes a substrate holder, a rotational driving unit, a cover body, a transfer mechanism, a cleaning liquid supply and a controller. The substrate holder is configured to hold a substrate. The rotational driving unit is configured to rotate the substrate holder. The cover body is configured to cover a top surface of the substrate held by the substrate holder. The transfer mechanism is configured to transfer a cleaning jig to the substrate holder. The cleaning liquid supply is configured to supply a cleaning liquid toward a bottom surface of the cleaning jig held by the substrate holder. The controller is configured to control the rotational driving unit to rotate the substrate holder. The cleaning jig is provided with at least one hole through which the cleaning liquid discharged from the cleaning liquid supply passes toward the cover body.

First claim

1 . A substrate processing apparatus, comprising:
a substrate holder configured to hold a substrate; a rotational driving unit configured to rotate the substrate holder; a cover body configured to cover a top surface of the substrate held by the substrate holder; a transfer mechanism configured to transfer a cleaning jig to the substrate holder; a cleaning liquid supply configured to supply a cleaning liquid toward a bottom surface of the cleaning jig held by the substrate holder; and a controller configured to control the rotational driving unit to rotate the substrate holder, wherein the cleaning jig is provided with at least one hole through which the cleaning liquid discharged from the cleaning liquid supply passes toward the cover body.

2 . The substrate processing apparatus of claim 1 ,
wherein the cleaning jig comprises: a plate member to be held by the substrate holder; and at least one wall member extending from the plate member toward the cover body, wherein the wall member is formed such that the cleaning liquid having passed through the hole collides with the wall member.

3 . The substrate processing apparatus of claim 2 ,
wherein the wall member is formed so as to be orthogonal to the plate member.

4 . The substrate processing apparatus of claim 2 ,
wherein the wall member is formed so as to be inclined with respect to the plate member.

5 . The substrate processing apparatus of claim 4 ,
wherein the wall member comprises at least one of a first wall member formed such that an upper end thereof faces a radially inner side of the cleaning jig or a second wall member formed such that an upper end thereof faces a radially outer side of the cleaning jig.

6 . The substrate processing apparatus of claim 1 ,
wherein the cleaning jig comprises: a plate member to be held by the substrate holder; and at least one blade member extending from the plate member toward the cover body.

7 . The substrate processing apparatus of claim 6 ,
wherein the rotational driving unit is configured to rotate the substrate holder in a first rotational direction and a second rotational direction opposite to the first rotational direction, the blade member comprises a first inclined surface having a first angle with respect to the plate member and a second inclined surface having a second angle with respect to the plate member, the second angle being larger than the first angle, when the cleaning jig is rotated in the first rotational direction, the first inclined surface is located at an upstream side in the corresponding rotational direction than the second inclined surface, and when the cleaning jig is rotated in the second rotational direction, the second inclined surface is located at an upstream side in the corresponding rotational direction than the first inclined surface.

8 . The substrate processing apparatus of claim 1 , further comprising:
a processing liquid supply configured to supply a processing liquid to the top surface of the substrate held by the substrate holder, wherein the cleaning liquid supply supplies the cleaning liquid toward a bottom surface of the substrate held by the substrate holder.

9 . The substrate processing apparatus of claim 1 ,
wherein the hole is formed along a circumferential direction of the cleaning jig.

10 . A substrate processing method, comprising:
transferring a cleaning jig to a substrate holder allowed to hold a substrate; rotating the substrate holder holding the cleaning jig thereon; and discharging a cleaning liquid toward a bottom surface of the cleaning jig held by the substrate holder, wherein the cleaning jig is provided with at least one hole through which the cleaning liquid discharged from a cleaning liquid supply passes toward a cover body covering a top surface of the cleaning jig.

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro

Classifications

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0412

  using mainly scrubbing means, e.g. brushes · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title