Substrate supporting unit and temperature control method thereof

Patent metadata

Field	Value
Publication number	US-2023376055-A1
Application number	US-202318142523-A
Country	US
Kind code	A1
Filing date	May 2, 2023
Priority date	May 18, 2022
Publication date	Nov 23, 2023
Grant date	—

Abstract

The present invention relates to a substrate support unit and a temperature control method of the substrate support unit, and more specifically, to a substrate support unit and a temperature control method of the substrate support unit, which can accurately measure and adjust the temperature of each zone when the substrate support unit that supports and heats a substrate is divided into a plurality of zones.

First claim

What is claimed is:

1 . A substrate support unit comprising:
a susceptor supporting a substrate; a resistance element provided in the susceptor to heat the substrate; a DC supply unit directly connected to the resistance element to apply DC voltage; and a control unit for calculating a temperature of the resistance element by measuring a voltage value and a resistance value of the resistance element and adjusting the temperature of the resistance element through the DC voltage control.

2 . The unit according to claim 1 , wherein the susceptor is divided into two or more areas, and the resistance element is disposed in each of the two or more areas, and
the DC supply unit is directly connected to each of the resistance element disposed in the two or more areas to independently apply DC voltage.

3 . The unit according to claim 2 , wherein two or more DC supply unit are provided to be independently connected to each of the resistance element.

4 . The unit according to claim 2 , wherein the susceptor is divided into a first area disposed in a center region and a second area disposed in an edge region, and the resistance element includes a first resistance element disposed in the first area and a second resistance element disposed in the second area.

5 . The unit according to claim 1 , wherein the control unit is provided with an analog-digital converter (ADC) channel for processing voltage value of the resistance element and an analog-digital converter channel for processing resistance values of the resistance element.

6 . The unit according to claim 1 , wherein a resistance-temperature table in which the resistance values of the resistance element are converted into temperatures is stored in the control unit.

7 . The unit according to claim 6 , wherein the temperatures in the resistance-temperature table are determined by an equation according to resistances and temperatures of the resistance element.

8 . The unit according to claim 7 , wherein the temperatures in the resistance-temperature table are provided through calibration of calculating a resistance value per unit temperature or a temperature coefficient of resistance(α) by directly measuring the temperatures of the resistance element or the substrate.

9 . The unit according to claim 1 , wherein the DC supply unit includes an AC input terminal for receiving AC voltage, a transformer, a rectifier for converting AC to DC, and a DC output terminal for outputting DC voltage, and an insulation member is included in the transformer.

10 . The unit according to claim 9 , wherein the susceptor further includes an ESC electrode for chucking the substrate, wherein a chucking DC supply unit for supplying a DC voltage to the ESC electrode includes an AC input terminal for receiving AC voltage, a transformer, a rectifier for converting AC to DC, and a DC output terminal for outputting DC voltage, and an insulation member is included in the transformer.

11 . A temperature control method of a substrate supporting unit having a susceptor provided with a resistance element for heating a substrate, the method comprising the steps of:
measuring a resistance value of the resistance element; calculating a temperature of the resistance element corresponding to the measured resistance value; and generating a resistance-temperature table including the resistance value and the temperature of the resistance element by repeating the steps of measuring a resistance value of the resistance element and calculating a temperature corresponding to the measured resistance value.

12 . The method according to claim 11 , further comprising the step of adjusting the temperature of the resistance element in a process for the substrate, wherein
the step of adjusting the temperature of the resistance element includes the steps of: supplying DC voltage to the resistance element from a DC supply unit; measuring a resistance value of the resistance element; extracting a temperature corresponding to the measured resistance value of the resistance from the resistance-temperature table; and adjusting the DC voltage supplied from the DC supply unit to the resistance element by comparing the extracted temperature value with a temperature required in a process for the substrate.

13 . The method according to claim 11 , further comprising, after the step of calculating a temperature corresponding to the measured resistance value, the step of providing the temperature of the resistance-temperature table through calibration of calculating a resistance value per unit temperature or a temperature coefficient of resistance(α) by directly measuring the temperature of the resistance element or the substrate.

Assignees

• Tes Co Ltd

Inventors

• Lim Kyung-Tae

Classifications

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/0602 Primary

  Temperature monitoring · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/722

  Details of electrostatic chucks · CPC title

• G05D23/2401 Primary

  using a heating element as a sensing element · CPC title