Package structure and package method

Patent metadata

Field	Value
Publication number	US-2023298954-A1
Application number	US-202318325599-A
Country	US
Kind code	A1
Filing date	May 30, 2023
Priority date	Nov 30, 2020
Publication date	Sep 21, 2023
Grant date	—

Abstract

A package structure includes a package substrate. The package structure further includes a printed circuit board on the package substrate. The printed circuit board includes a board body, wherein the board body includes an annular structure, and the annular structure exposes a portion of the package substrate configured to receive a die. The printed circuit board further includes a metal pin on the board body, wherein the metal pin extends beyond the board body in a direction parallel to a top surface of the package substrate, the metal pin is configured to connect to an external circuit, and the metal pin is further configured to connect to the die in response to the die being on the package substrate.

First claim

1 . A package structure, comprising:
a package substrate; and a printed circuit board on the package substrate, wherein the printed circuit board comprises:
a board body, wherein the board body includes an annular structure, and the annular structure exposes a portion of the package substrate configured to receive a die; and
a metal pin on the board body, wherein the metal pin extends beyond the board body in a direction parallel to a top surface of the package substrate, the metal pin is configured to connect to an external circuit, and the metal pin is further configured to connect to the die in response to the die being on the package substrate.

2 . The package structure according to claim 1 , wherein a thickness range of the metal pin is 0.04 millimeter to 1 millimeter.

3 . The package structure according to claim 1 , wherein a length range of the metal pin extending beyond the board body is 0.2 millimeter to 20 millimeters.

4 . The package structure according to claim 1 , wherein the metal pin extending beyond the board body is bent toward the package substrate.

5 . The package structure according to claim 1 , wherein the board body comprises:
a first part on an upper surface of the package substrate, wherein the first part includes the annular structure, and a second part on at least one side wall of the package substrate, wherein the first part is integral with the second part.

6 . The package structure according to claim 1 , wherein the printed circuit board further comprises a conductive wire on the board body.

7 . The package structure according to claim 1 , further comprising a protective lid covering the printed circuit board.

8 . The package structure according to claim 1 , further comprising an insulation gel bonded to the package substrate and the printed circuit board.

9 . A package method, comprising:
fastening a die on a package substrate; fastening a printed circuit board on the package substrate, wherein the printed circuit board comprises:
a board body, wherein the board body includes an annular structure, and the annular structure surrounds the die fastened to the package substrate; and
a metal pin on the board body, wherein the metal pin extends beyond the board body in a direction parallel to a top surface of the package substrate, and the metal pin is configured to connect to an external circuit; and
connecting the metal pin and the die.

10 . The package method according to claim 9 , wherein a thickness range of the metal pin is 0.04 millimeter to 1 millimeter.

11 . The package method according to claim 9 , wherein a length range of the metal pin extending beyond the board body is 0.2 millimeter to 20 millimeters.

12 . The package method according to claim 9 , further comprising bending the metal pin toward the package substrate.

13 . The package method according to claim 9 , wherein the board body comprises:
a first part on an upper surface of the package substrate, wherein the first part includes the annular structure, and a second part on at least one side wall of the package substrate, wherein the first part and the second part are integral.

14 . The package method according to claim 9 , wherein the printed circuit board further comprises a conductive wire on the board body.

15 . The package method according to claim 9 , wherein the method further comprises:
covering the printed circuit board with a protective lid.

16 . The package method according to claim 9 , further comprising:
bonding the printed circuit board to the package substrate using insulation gel.

17 . A package structure, comprising:
a package substrate; and a printed circuit board on the package substrate, wherein the printed circuit board comprises:
a board body, wherein the board body includes an annular structure, and the annular structure exposes a portion of the package substrate configured to receive at least one die; and
a plurality of metal pins on the board body, wherein each of the plurality of metal pins extends beyond the board body in a first direction parallel to a top surface of the package substrate, each of the plurality of metal pins the metal pin is configured to connect to an external circuit, and each of the plurality of metal pins is further configured to connect to a corresponding die of the at least one die in response to the at least one die being on the package substrate; and
a first conductive wire extending in the first direction across an opening in the annular structure.

18 . The package structure of claim 17 , further comprising:
a second conductive wire extending beyond the annular structure in a second direction parallel to the top surface of the package substrate, wherein the first direction is perpendicular to the second direction.

19 . The package structure of claim 17 , further comprising a plurality of dies, including the at least one die, on the package substrate.

20 . The package structure of claim 19 , wherein the first conductive wire is between, in a plan view, a first die of the plurality of dies and a second die of the plurality of dies.

Assignees

• Huawei Tech Co Ltd

Inventors

• Lin Yanhai
• Huang Mingli
• Zhang Xiaomin
• Huang An
• Yang Guanqiao

Classifications

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W72/075

  of bond wires · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W76/15

  Containers comprising an insulating or insulated base · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title