Anisotropic Electrically Conductive Film and Connection Structure

Patent metadata

Field	Value
Publication number	US-2018301432-A1
Application number	US-201615576759-A
Country	US
Kind code	A1
Filing date	May 27, 2016
Priority date	May 27, 2015
Publication date	Oct 18, 2018
Grant date	—

Abstract

An anisotropic electrically conductive film includes electrically conductive particles disposed in an electrically insulating adhesive layer. The particles are arranged at a predetermined pitch along first axes, arranged side by side, and are substantially spherical. The particle pitch at the first axes and the axis pitch of the first axes are both greater than or equal to 1.5D, D being an average particle diameter of the particles. Directions of all sides of a triangle formed by a particle (P 0 ), which is one of the electrically conductive particles at one of the first axes, an electrically conductive particle (P 1 ), which is at the one of the first axes and adjacent to the particle (P 0 ), and an electrically conductive particle (P 2 ), which is at another one of the first axes that is adjacent to the one of the first axes, are oblique to a film width direction of the conductive film.

First claim

1 . An anisotropic electrically conductive film comprising:
an electrically insulating adhesive layer; and electrically conductive particles disposed in the electrically insulating adhesive layer, wherein the electrically conductive particles are arranged such that first axes, along which the electrically conductive particles are arranged at a predetermined particle pitch, are arranged side by side at a predetermined axis pitch, the electrically conductive particles are substantially spherical, an electrically conductive particle pitch L 1 at the first axes is greater than or equal to 1.5D and an axis pitch L 3 of the first axes is greater than or equal to 1.5D where D is an average particle diameter of the electrically conductive particles, and directions of all sides of a triangle formed by an electrically conductive particle P 0 , an electrically conductive particle P 1 , and an electrically conductive particle P 2 are oblique to a film width direction of the anisotropic electrically conductive film, the electrically conductive particle P 0 being any one of the electrically conductive particles at any one of the first axes, the electrically conductive particle P 1 being at the one of the first axes and adjacent to the electrically conductive particle P 0 , the electrically conductive particle P 2 being at another one of the first axes that is adjacent to the one of the first axes, and the electrically conductive particle P 2 being spaced from the electrically conductive particle P 0 by a minimum spacing.

2 . The anisotropic electrically conductive film according to claim 1 , wherein the electrically conductive particles have a sphericity ranging from 70 to 100, the sphericity being calculated by the equation:
Sphericity={1−( So−Si )/ So}× 100
where So is an area of a circumscribed circle of an electrically conductive particle in a plane image of the electrically conductive particles and Si is an area of an inscribed circle of the electrically conductive particle in the plane image of the electrically conductive particles.

3 . The anisotropic electrically conductive film according to claim 1 , wherein a film length of the anisotropic electrically conductive film is greater than or equal to 5000 times a film width of the anisotropic electrically conductive film.

4 . The anisotropic electrically conductive film according to claim 1 , wherein the electrically conductive particles are arranged in the directions of all the sides of the triangle.

5 . The anisotropic electrically conductive film according to claim 1 , wherein the first axes are arrangement axes having a minimum particle pitch.

6 . The anisotropic electrically conductive film according to claim 1 , wherein, provided that the electrically conductive particles are arranged in the directions of all the sides of the triangle and the first axes, second axes, and third axes are defined as lattice axes formed by extensions of the sides, a particle pitch along at least one lattice axis includes wide and narrow pitches that repeat in a regular manner.

7 . The anisotropic electrically conductive film according to claim 1 , wherein, provided that the electrically conductive particles are arranged in the directions of all the sides of the triangle and the first axes, second axes, and third axes are defined as lattice axes form by extensions of the sides, an axis pitch of at least one lattice axis includes wide and narrow pitches that occur in a regular manner.

8 . The anisotropic electrically conductive film according to claim 1 , wherein, provided that the electrically conductive particles are arranged in the directions of all the sides of the triangle and the first axes, second axes, and third axes are defined as lattice axes formed by extensions of the sides, the anisotropic electrically conductive film includes fourth axes that are lattice axes extending in a same direction as the first axes, the second axes, or the third axes, the fourth axes including arrangements of electrically conductive particles corresponding to the arrangements of the first axes, the second axes, or the third axes except that some electrically conductive particles among the electrically conductive particles are missing in a regular manner, the first axes, the second axes, or the third axes being in the same direction as the fourth axes.

9 . A connection structure comprising:
the anisotropic electrically conductive film according to claim 1 ; a first electric component; and a second electric component, an anisotropically electrically conductive connection being formed between the first electronic component and the second electronic component using the anisotropic electrically conductive film.

Assignees

• Dexerials Corp

Inventors

• Shinohara Seiichiro

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W72/01335

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/01315

  Forming coatings · CPC title