Conductive line structure having corrugated surface

Patent metadata

Field	Value
Publication number	US-2023197610-A1
Application number	US-202117645306-A
Country	US
Kind code	A1
Filing date	Dec 20, 2021
Priority date	Dec 20, 2021
Publication date	Jun 22, 2023
Grant date	—

Abstract

The disclosed subject matter relates generally to structures in semiconductor devices and integrated circuit (IC) chips. More particularly, the present disclosure relates to a structure for use in a conductive line. The present disclosure also relates to a method of forming the structures. The present disclosure provides a structure in a semiconductor device, the structure having a corrugated surface on at least one of its sides. The disclosed structures may have smaller or no micro-trenches and may therefore increase the breakdown voltage of the structures.

First claim

What is claimed is:

1 . A structure in a semiconductor device, the structure comprising:
a lower surface; an upper surface above the lower surface; and at least one side having a corrugated surface, the corrugated surface comprising a plurality of ridges, the ridges are elongated and extend from the upper surface to the lower surface.

2 . The structure of claim 1 , further comprising:
a first side having a corrugated surface, the corrugated surface on the first side comprises a first plurality of ridges arranged along a horizontal direction parallel to the first side; and a second side having a corrugated surface, the corrugated surface on the second side comprises a second plurality of ridges arranged along a horizontal direction parallel to the second side.

3 . The structure of claim 2 , wherein the first side is oppositely facing the second side.

4 . The structure of claim 3 , wherein the ridges on the first side are substantially aligned with the ridges on the second side.

5 . The structure of claim 3 , wherein the ridges on the first side are positioned offset from the ridges on the second side.

6 . The structure of claim 2 , wherein the second side adjoins the first side.

7 . The structure of claim 3 , further comprising a third side having a corrugated surface, the corrugated surface on the third side comprises a third plurality of ridges arranged along a horizontal direction parallel to the third side, wherein the third side is between the first side and the second side.

8 . The structure of claim 7 , wherein the third side is at right angles to the first side and the second side.

9 . The structure of claim 1 , wherein each ridge in the plurality of ridges has a pair of sidewalls and a surface raised above the side with the corrugated surface.

10 . The structure of claim 9 , wherein the pair of sidewalls of each ridge are tapered towards each other as they meet the surface of each ridge.

11 . The structure of claim 9 , wherein the pair of sidewalls of each ridge are substantially parallel with each other.

12 . The structure of claim 9 , wherein the surface and the sidewalls of each ridge are elongated and extend from the upper surface of the structure to the lower surface of the structure.

13 . The structure of claim 9 , wherein the surface of each ridge in the plurality of ridges is an edge and the pair of sidewalls of each ridge taper towards each other as they meet the edge.

14 . The structure of claim 1 , wherein each ridge in the plurality of ridges is rounded and having a convex surface, the convex surface is raised radially outwards from the side with the corrugated surface.

15 . The structure of claim 1 , wherein the corrugated surface further comprises a plurality of grooves, and wherein the grooves and the ridges are arranged in an alternating configuration, and two laterally adjacent ridges are spaced apart by each groove.

16 . The structure of claim 1 , wherein the plurality of ridges has a substantially constant pitch.

17 . A semiconductor device comprising:
a dielectric layer; and a conductive line in the dielectric layer, the conductive line comprising a structure, the structure in the conductive line comprising at least one side having a corrugated surface, a lower surface, and an upper surface above the lower surface, the corrugated surface comprising a plurality of ridges, the ridges are elongated and extend from the upper surface to the lower surface.

18 . The semiconductor device of claim 17 , wherein the conductive line comprises a serpentine layout.

19 . The semiconductor device of claim 17 , wherein the conductive line comprises a comb layout.

20 . A method of forming a conductive line in a semiconductor device, the method comprising:
forming a structure in a dielectric layer, the structure comprising at least one side having a corrugated surface, a lower surface, and an upper surface above the lower surface, the corrugated surface comprising a plurality of ridges, the ridges are elongated and extend from the upper surface to the lower surface.

Assignees

• Globalfoundries Sg Pte Ltd

Inventors

• Kang Kai
• Yi Wanbing
• Ong Ran Xing
• Hsieh Curtis Chun-I
• Tan Juan Boon

Classifications

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• H10W20/43

  Layouts of interconnections · CPC title

• H10W20/084

  for dual-damascene structures · CPC title

• H10W20/435 Primary

  Cross-sectional shapes or dispositions of interconnections · CPC title

• H10W20/42 Primary

  Vias, e.g. via plugs · CPC title