Display substrate and method for manufacturing the same, and display device

Patent metadata

Field	Value
Publication number	US-2023163135-A1
Application number	US-202117614662-A
Country	US
Kind code	A1
Filing date	Feb 19, 2021
Priority date	Feb 19, 2021
Publication date	May 25, 2023
Grant date	—

Abstract

A display substrate includes a first display region and a second display region. The display substrate may include: a first base substrate; a second base substrate; a first barrier layer and a light emitting unit. The first base substrate includes a first through region penetrating the first base substrate, and the first barrier layer includes a second through region penetrating the first barrier layer. The second base substrate includes a first substrate sub-portion located in the first display region, the first substrate sub-portion penetrates the second through region, and at least a portion of the first substrate sub-portion is located in the first through region. The display substrate includes a recessed portion. The second base substrate includes a first surface located in the first display region and a second surface located in the second display region, and the first surface and the second surface are formed as a flat surface.

First claim

1 . A display substrate, comprising a first display region and a second display region, wherein the display substrate comprises:
a first base substrate; a second base substrate located on a side of the first base substrate; a first barrier layer between the first base substrate and the second base substrate; and a light emitting unit on a side of the second base substrate away from the first base substrate, wherein the first base substrate comprises a first through region penetrating the first base substrate, and an orthographic projection of the first through region on the first base substrate is located in an orthographic projection of the first display region on the first base substrate; wherein the first barrier layer comprises a second through region penetrating the first barrier layer, and an orthographic projection of the second through region on the first base substrate coincides with the orthographic projection of the first through region on the first base substrate; wherein the second base substrate comprises a first substrate sub-portion located in the first display region, the first substrate sub-portion penetrates the second through region, and at least a part of the first substrate sub-portion is located in the first through region, the display substrate comprises a recessed portion, and an orthographic projection of the recessed portion on the first base substrate coincides with the orthographic projection of the first through region on the first base substrate; and wherein the second base substrate comprises a first surface and a second surface that are located on a side away from the first base substrate, the first surface is located in the first display region, the second surface is located in the second display region, and the first surface and the second surface are formed as a flat surface.

2 . The display substrate of claim 1 , wherein at least one light emitting unit is arranged in the first display region.

3 . The display substrate of claim 1 , wherein the second base substrate comprises a second substrate sub-portion located in the second display region, and a thickness of the first substrate sub-portion is greater than a thickness of the second substrate sub-portion by 0.5 micron to 2 microns.

4 . The display substrate of claim 1 , wherein a depth of the recessed portion is less than a thickness of the first base substrate by 0.5 micron to 2 microns.

5 . The display substrate of claim 1 , wherein the first base substrate and the second base substrate contain a material of polyimide.

6 . The display substrate of claim 1 , wherein a thickness of the first base substrate is 3 microns to 8 microns; or
wherein a thickness of the second base substrate is 3 microns to 5 microns; or wherein the thickness of the first base substrate is greater than the thickness of the second base substrate by 1 micron to 5 microns.

7 . The display substrate of claim 1 , wherein a depth of the recessed portion is 75%˜95% of a thickness of the first base substrate; or
wherein at least one sidewall of the recessed portion has a slope angle within a range of 40° to 80°.

8 . The display substrate of claim 1 , wherein an orthographic projection of the recessed portion on the first base substrate has an area substantially equal to an area of the first display region; or
wherein the area of the orthographic projection of the recessed portion on the first base substrate is 0.1%˜30% of an area of a combination of the first display region and the second display region.

9 . The display substrate of claim 2 , wherein a plurality of light emitting units are provided in the second display region, and a distribution density of the light emitting units in the first display region is less than a distribution density of the light emitting units in the second display region.

10 . A display device comprising an image sensor and the display substrate of claim 1 , wherein an orthographic projection of the image sensor on the first base substrate is located in the first display region.

11 . A method for manufacturing a display substrate, comprising:
forming a reinforcement layer in a first region of a glass back plate; forming a first substrate material layer on the glass back plate, wherein the first substrate material layer covers the reinforcement layer; forming a first harrier material layer on a side of the first substrate material layer away from the glass back plate; removing a part of the first barrier material layer and a part of the first substrate material layer that are located in the first region by a patterning process so as to form a first base substrate and a first barrier layer, and to expose a surface of the reinforcement layer away from the glass back plate; forming a second substrate material layer on a side of the first barrier layer away from the glass back plate so as to form a second base substrate, wherein a part of the second base substrate in the first region is in contact with the reinforcement layer, and a surface of the second base substrate away from the first base substrate is a flat surface; and separating both the glass back plate and the reinforcement layer from the first base substrate and the second base substrate so as to form a recessed portion in the first region, wherein a first adhesion force is formed between the reinforcement layer and the glass back plate, a second adhesion force is formed between the reinforcement layer and the second base substrate, and the first adhesion force is greater than the second adhesion force.

12 . The method of claim 11 , wherein the forming a reinforcement layer comprises:
forming a first metal layer in the first region of the glass back plate; forming a retaining wall in a second region of the glass back plate, so that the retaining wall and the first metal layer form the recessed portion in the first region; forming, in the first region, a second metal layer on a side of the first metal layer away from the glass back plate, so that the second metal layer fills the recessed portion; and removing the retaining wall.

13 . The method of claim 12 , wherein the forming a reinforcement layer further comprises:
forming a third metal layer on a side of the second metal layer away from the glass back plate.

14 . The method of claim 12 , wherein the first metal layer is formed by a magnetron sputtering process:
wherein the second metal layer is formed by an electroplating process; and wherein the first metal layer contains a material of copper.

15 . (canceled)

16 . The method of claim 13 , wherein the third metal layer is formed by a patterning process:
wherein the first metal layer and the second metal layer contain a same material, and the third metal layer contains a material different from the material of the first metal layer.

17 . (canceled)

18 . (canceled)

19 . The method of claim 16 , wherein the third metal layer comprises a single-layer structure containing molybdenum; or
wherein the third metal layer comprises a stacked-layer structure comprising a first sub-layer, a third sub-layer, and a second sub-layer sandwiched between the first sub-layer and the third sub-layer, the first sub-layer and the third sub-layer contain a same material, the first sub-layer contains molybdenum-niobium-titanium alloy or titanium, and the second sub-layer contains copper or aluminum.

20 . The method of claim 11 , wherein the removing a part of the first barrier material layer and a portion of the first substrate material lay

Assignees

• Boe Technology Group Co Ltd

Inventors

• Zhu Xiaoyan
• Xu Chuanxiang
• Li Ling
• Huang Hua

Classifications

• H10P72/7426

  used as a support during build up manufacturing of active devices · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• H10P72/743

  used as a support during manufacture of interconnect decals or build up layers · CPC title

• H10P72/7424

  used as a support during the manufacture of self-supporting substrates · CPC title

• H10K59/65

  OLEDs integrated with inorganic image sensors · CPC title