Quantum-cascade laser element and quantum-cascade laser device

US2023139139A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023139139-A1
Application numberUS-202117914806-A
CountryUS
Kind codeA1
Filing dateMar 25, 2021
Priority dateApr 2, 2020
Publication dateMay 4, 2023
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A quantum-cascade laser element includes: an embedding layer including a first portion formed on a side surface of a ridge portion, and a second portion extending from an edge portion of the first portion on a side of a semiconductor substrate along a width direction of the semiconductor substrate; and a metal layer formed at least on a top surface of the ridge portion and on the first portion. A surface of the second portion on a side opposite to the semiconductor substrate is located between a surface of an active layer on a side opposite to the semiconductor substrate and a surface of the active layer on a side of the semiconductor substrate. When viewed in the width direction of the semiconductor substrate, a part of the metal layer on the first portion overlaps the active layer. The metal layer is directly formed on the first portion.

First claim

Opening claim text (preview).

1 : A quantum-cascade laser element comprising: a semiconductor substrate; a semiconductor laminate formed on the semiconductor substrate to include a ridge portion configured to include an active layer having a quantum-cascade structure; an embedding layer including a first portion formed on a side surface of the ridge portion, and a second portion extending from an edge portion of the first portion on a side of the semiconductor substrate along a width direction of the semiconductor substrate; and a metal layer formed at least on a top surface of the ridge portion and on the first portion, wherein, in a thickness direction of the semiconductor substrate, a surface of the second portion on a side opposite to the semiconductor substrate is located between a surface of the active layer on a side opposite to the semiconductor substrate and a surface of the active layer on a side of the semiconductor substrate, when viewed in the width direction of the semiconductor substrate, a part of the metal layer on the first portion overlaps the active layer, and the metal layer is directly formed on the first portion. 2 : The quantum-cascade laser element according to claim 1 , wherein a thickness of the first portion is thinner than a thickness of the second portion. 3 : The quantum-cascade laser element according to claim 1 , wherein the metal layer is formed on the top surface of the ridge portion, on the first portion, and on the second portion, and a dielectric layer is disposed between the second portion and the metal layer. 4 : The quantum-cascade laser element according to claim 3 , wherein the dielectric layer is formed such that a part of the second portion is exposed from the dielectric layer, and the metal layer is in contact with the second portion at the part. 5 : The quantum-cascade laser element according to claim 3 , wherein an opening that exposes an inner portion of the second portion from the dielectric layer is formed in the dielectric layer, the inner portion being continuous with the first portion, and the metal layer is in contact with the inner portion through the opening. 6 : The quantum-cascade laser element according to claim 5 , wherein a width of the opening in the width direction of the semiconductor substrate is more than or equal to two times a width of the active layer. 7 : The quantum-cascade laser element according to claim 5 , wherein a width of the opening in the width direction of the semiconductor substrate is more than or equal to ten times a thickness of the second portion. 8 : The quantum-cascade laser element according to claim 3 , further comprising: a wire made of metal, that is electrically connected to the metal layer, and a connection position between the metal layer and the wire overlaps the dielectric layer when viewed in the thickness direction of the semiconductor substrate. 9 : A quantum-cascade laser device comprising: the quantum-cascade laser element according to claim 1 ; and a drive unit that drives the quantum-cascade laser element.

Assignees

Inventors

Classifications

  • the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers (comprising a photonic bandgap structure H01S5/11; surface-emitting lasers H01S5/18) · CPC title

  • characterised by the shape · CPC title

  • semi-insulating semiconductors · CPC title

  • Single longitudinal mode emission · CPC title

  • mesa created by etching · CPC title

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What does patent US2023139139A1 cover?
A quantum-cascade laser element includes: an embedding layer including a first portion formed on a side surface of a ridge portion, and a second portion extending from an edge portion of the first portion on a side of a semiconductor substrate along a width direction of the semiconductor substrate; and a metal layer formed at least on a top surface of the ridge portion and on the first portion.…
Who is the assignee on this patent?
Hamamatsu Photonics Kk
What technology area does this patent fall under?
Primary CPC classification H01S5/3402. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu May 04 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).