Quantum cascade laser element and quantum cascade laser device

Patent metadata

Field	Value
Publication number	US-2023132974-A1
Application number	US-202117914525-A
Country	US
Kind code	A1
Filing date	Mar 25, 2021
Priority date	Apr 2, 2020
Publication date	May 4, 2023
Grant date	—

Abstract

A quantum-cascade laser element includes: a semiconductor substrate; a semiconductor mesa formed on the semiconductor substrate to include an active layer having a quantum-cascade structure and to extend along a light waveguide direction; an embedding layer formed to interpose the semiconductor mesa along a width direction of the semiconductor substrate; a cladding layer formed over the semiconductor mesa and over the embedding layer; and a metal layer formed on the cladding layer. A pair of groove portions extending along the light waveguide direction are formed in a surface on an opposite side of the cladding layer from the semiconductor substrate. The pair of groove portions are disposed in two respective outer regions when the cladding layer is equally divided into four regions in the width direction of the semiconductor substrate. The metal layer enters the pair of groove portions.

First claim

1 : A quantum-cascade laser element comprising:
a semiconductor substrate; a semiconductor mesa formed on the semiconductor substrate to include an active layer having a quantum-cascade structure and to extend along a light waveguide direction; an embedding layer formed to interpose the semiconductor mesa along a width direction of the semiconductor substrate; a cladding layer formed over the semiconductor mesa and over the embedding layer; and a metal layer formed on the cladding layer, wherein a pair of groove portions extending along the light waveguide direction are formed in a surface of the cladding layer on a side opposite to the semiconductor substrate, the pair of groove portions are disposed in two outer regions respectively when the cladding layer is equally divided into four regions in the width direction of the semiconductor substrate, and the metal layer enters the pair of groove portions.

2 : The quantum-cascade laser element according to claim 1 ,
wherein the pair of groove portions reach the embedding layer.

3 : The quantum-cascade laser element according to claim 1 , further comprising:
a plating layer formed on the metal layer, wherein a recessed portion is formed in a surface of the plating layer on a side opposite to the semiconductor substrate.

4 : The quantum-cascade laser element according to claim 3 ,
wherein a pair of the recessed portions are provided, and the pair of recessed portions overlap the pair of groove portions respectively when viewed in a thickness direction of the semiconductor substrate.

5 : The quantum-cascade laser element according to claim 1 , further comprising:
a dielectric layer disposed between the cladding layer and the metal layer, wherein an opening that exposes the cladding layer from the dielectric layer in a region overlapping the semiconductor mesa when viewed in a thickness direction of the semiconductor substrate is formed in the dielectric layer, and the metal layer is in contact with the cladding layer through the opening.

6 : The quantum-cascade laser element according to claim 5 ,
wherein the dielectric layer enters the pair of groove portions.

7 : The quantum-cascade laser element according to claim 5 ,
wherein a width of the opening in the width direction of the semiconductor substrate is more than or equal to two times a width of the semiconductor mesa.

8 : The quantum-cascade laser element according to claim 5 ,
wherein a width of the opening in the width direction of the semiconductor substrate is more than or equal to ten times a thickness of the cladding layer.

9 : The quantum-cascade laser element according to claim 5 , further comprising:
a wire made of metal, that is electrically connected to the metal layer, and wherein a connection position between the metal layer and the wire overlaps the dielectric layer when viewed in the thickness direction of the semiconductor substrate.

10 : The quantum-cascade laser element according to claim 1 ,
wherein a thickness of the cladding layer is thinner in a second region located outside a first region in the width direction of the semiconductor substrate than in the first region of which at least a part overlaps the semiconductor mesa when viewed in a thickness direction of the semiconductor substrate, and the metal layer extends over the first region and the second region.

11 : The quantum-cascade laser element according to claim 10 ,
wherein a width of the cladding layer in the first region is more than or equal to a width of the semiconductor mesa.

12 : The quantum-cascade laser element according to claim 10 ,
wherein a width of the cladding layer in the first region is less than or equal to four times a width of the semiconductor mesa.

13 : The quantum-cascade laser element according to claim 10 ,
wherein the thickness of the cladding layer in the second region is less than or equal to half the thickness of the cladding layer in the first region.

14 : The quantum-cascade laser element according to claim 10 ,
wherein the surface of the cladding layer on a side opposite to the semiconductor substrate includes an inclined surface formed at a boundary portion between the first region and the second region, and when viewed in the light waveguide direction, the inclined surface is inclined to go outward as approaching the semiconductor substrate.

15 : The quantum-cascade laser element according to claim 14 ,
wherein when viewed in the light waveguide direction, the inclined surface is curved to protrude toward the active layer.

16 : The quantum-cascade laser element according to claim 1 ,
wherein a thickness of the cladding layer is uniform except for a portion at which the pair of groove portions are formed.

17 : A quantum-cascade laser device comprising:
the quantum-cascade laser element according to claim 1 ; and a drive unit that drives the quantum-cascade laser element.

18 : The quantum-cascade laser device according to claim 17 , further comprising:
a support member including an electrode pad and supporting the quantum-cascade laser element; and a joining material that joins the support member and the quantum-cascade laser element, wherein the quantum-cascade laser element includes a plating layer formed on the metal layer, a recessed portion is formed in a surface of the plating layer on a side opposite to the semiconductor substrate, and the joining material joins the electrode pad and the plating layer in a state where the semiconductor mesa is located on a side of the support member with respect to the semiconductor substrate and the joining material enters the recessed portion.

19 : The quantum-cascade laser device according to claim 17 ,
wherein the drive unit drives the quantum-cascade laser element to continuously oscillate laser light.

Assignees

• Hamamatsu Photonics Kk

Inventors

• Sugiyama Atsushi
• Edamura Tadataka
• Akikusa Naota

Classifications

• H01S5/3401 Primary

  having no PN junction, e.g. unipolar lasers, intersubband lasers, quantum cascade lasers · CPC title

• H01S5/02461

  Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity · CPC title

• H01S5/0234 Primary

  Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings · CPC title

• H01S5/12

  the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers (comprising a photonic bandgap structure H01S5/11; surface-emitting lasers H01S5/18) · CPC title

• H01S5/0287

  Facet reflectivity · CPC title