Distance sensor module

Patent metadata

Field	Value
Publication number	US-2022373648-A1
Application number	US-202017770897-A
Country	US
Kind code	A1
Filing date	Sep 24, 2020
Priority date	Oct 22, 2019
Publication date	Nov 24, 2022
Grant date	—

Abstract

The present invention comprises: a circuit board; a laser diode mounted on the circuit board; a photodiode mounted on the circuit board; and a drive integrated circuit which is mounted on the circuit board and drives the laser diode and the photodiode, wherein the circuit board includes a circuit forming unit in which wiring layers for electrically connecting the drive integrated circuit to the laser diode are stacked. The present invention has an advantage in that the drive integrated circuit is included in a distance sensor module so as to be manufactured as a single module, and a ferrite chip bead is included in the module so as to reduce noise.

First claim

1 . A distance sensor module comprising:
a circuit board; a laser diode mounted on the circuit board; a photodiode mounted on the circuit board; and a drive integrated circuit mounted on the circuit board and driving the laser diode and the photodiode, wherein the circuit board comprises a circuit forming unit in which wiring layers for electrically connecting the drive integrated circuit to the laser diode are stacked.

2 . The distance sensor module of claim 1 ,
wherein the circuit forming unit comprises a ferrite layer printed by pasting a ferrite between the wiring layer and the wiring layer in order to increase a mutual inductance.

3 . The distance sensor module of claim 1 ,
comprising: a spiral coil circuit unit stacked under the circuit board, wherein the spiral coil circuit unit is an inductor having a bead structure formed by patterning a coil on the ferrite layer.

4 . The distance sensor module of claim 1 ,
comprising: an interposer disposed under the circuit board to secure a height of the circuit board.

5 . The distance sensor module of claim 4 ,
wherein a shielding material is disposed by surrounding an outer surface of the interposer.

6 . The distance sensor module of claim 4 ,
wherein the interposer is formed in a ‘ ’-shaped cross-sectional structure with an opened lower portion, and a ferrite chip bead is mounted on a bottom surface of the interposer.

7 . The distance sensor module of claim 4 ,
wherein the interposer is formed in a ‘ ’-shaped cross-sectional structure having an internal space with an opened lower portion, and a ferrite chip bead and an MLCC are mounted on a bottom surface of the interposer and disposed in the internal space.

8 . The distance sensor module of claim 4 ,
wherein the interposer is formed by bonding both a ‘ ’-shaped cross-sectional structure having an internal space with an opened lower portion and a ‘ ’-shaped cross-sectional structure having an internal space with an opened upper portion, and a ferrite chip bead is mounted on at least one of the two structures to be disposed in the internal space.

9 . The distance sensor module of claim 4 ,
wherein the interposer is formed in a rectangular shape opened up and down, and a ferrite chip bead is mounted under the circuit board corresponding to the internal space surrounded and formed by the interposer.

Assignees

• Amosense Co Ltd

Inventors

• Lim Byungguk

Classifications

• H01F17/0013

  with stacked layers · CPC title

• G01S7/481 Primary

  Constructional features, e.g. arrangements of optical elements · CPC title

• H01F2027/2809

  on stacked layers · CPC title

• G01S17/08

  for measuring distance only (indirect measurement G01S17/46; active triangulation systems G01S17/48) · CPC title

• H05K9/0081

  Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence) · CPC title