Multilayer device and manufacturing method of the same

Patent metadata

Field	Value
Publication number	US-9466416-B2
Application number	US-201414496034-A
Country	US
Kind code	B2
Filing date	Sep 25, 2014
Priority date	May 21, 2012
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

A multilayer inductor device in which parasitic inductance is made smaller while preventing increase in a mounting area of the device and complexity of a wiring pattern, and a manufacturing method of the stated multilayer inductor device. An outer electrode and a terminal electrode are connected to each other through a via hole. A side surface of a non-magnetic member forms a part of an end surface of the device, while the other side surface thereof being in contact with the via hole. A side surface of the via hole that makes contact with the non-magnetic member is opened, which prevents the parasitic inductance from being increased. The via hole being provided in an arbitrary position makes it possible to prevent the wiring pattern from being complicated and a mounting area of the device from being increased.

First claim

The invention claimed is:

1. A multilayer device comprising:
a multilayer body in which a plurality of substrates including magnetic-member substrates are laminated;
a first land electrode being provided on an uppermost surface of the multilayer body;
a second land electrode being provided on a lowermost surface of the multilayer body;
a via hole provided inside a magnetic member layer of the multilayer body and electrically connecting the first land electrode and the second land electrode to each other; and
a non-magnetic member extending from the uppermost surface to the lowermost surface and contacting with the via hole.

2. An electronic component module comprising:
the multilayer device according to claim 1 ; and
an electronic component mounted on the first land electrode.

Assignees

• Murata Manufacturing Co

Inventors

• Yokoyama Tomoya
• Nanjyo Jyunichi

Classifications

• H01F27/292

  Surface mounted devices · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F17/0013 Primary

  with stacked layers · CPC title

• Y10T29/49165

  by forming conductive walled aperture in base · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title