Apparatus and method for treating substrate

Patent metadata

Field	Value
Publication number	US-2022208564-A1
Application number	US-202117563189-A
Country	US
Kind code	A1
Filing date	Dec 28, 2021
Priority date	Dec 28, 2020
Publication date	Jun 30, 2022
Grant date	—

Abstract

A substrate treating device includes a liquid treating chamber for liquid-treating a substrate therein, a drying chamber for dry-treating the liquid-treated substrate, a transfer device for transferring the substrate between the liquid treating chamber and the drying chamber, and a controller for controlling the liquid treating chamber and the transfer device. The transfer device includes a transfer robot having a hand for placing the substrate thereon, and a heating member for heating the substrate. The controller controls the transfer device such that the heating member of the transfer device heats a liquid on the substrate to a first temperature before the transfer device transfers the substrate taken out from the liquid treating chamber to the drying chamber.

First claim

1 . A substrate treating apparatus comprising:
a liquid treating chamber configured to perform liquid-treating on a substrate therein; a drying chamber configured to perform dry-treating on the substrate received from the liquid treating chamber; a transfer device configure to transfer the substrate between the liquid treating chamber and the drying chamber; and a controller configured to control the liquid treating chamber and the transfer device, wherein the transfer device comprises:
a transfer robot having a hand configured to place the substrate thereon; and
a heating member configured to heat the substrate, and
wherein the controller controls the transfer device such that the heating member of the transfer device heats a liquid on the substrate to a first temperature before the transfer device transfers the substrate taken out from the liquid treating chamber to the drying chamber.

2 . The apparatus of claim 1 , wherein the heating member is a heater provided at the hand.

3 . The apparatus of claim 1 , wherein the heating member is provided as a heating chamber between the liquid treating chamber and the drying chamber, and
the heating chamber comprises: a housing with an opening allowing an entry/exit of the hand; a support unit for placing the substrate thereon; and a gas supply device for supplying a high temperature gas to an inner space of the housing.

4 . The apparatus of claim 1 , wherein the heating member is provided as a heating plate provided having a heater therein and disposed between the liquid treating chamber and the drying chamber.

5 . The apparatus of claim 1 , wherein the controller controls the liquid treating chamber as to supply the liquid at a second temperature to the substrate within the liquid treating chamber, and controls the transfer device for t the heating member to heat the liquid on the substrate to the first temperature, the first temperature being higher temperature than the second temperature.

6 . The apparatus of claim 5 , wherein the second temperature is higher temperature than a room temperature.

7 . The apparatus of claim 1 , wherein the liquid is an organic solvent, and a supercritical fluid is supplied to an inside of the drying chamber.

8 . The apparatus of claim 1 , wherein the first temperature is lower than a boiling point of the liquid.

9 .- 20 . (canceled)

Assignees

• Semes Co Ltd

Inventors

• Lim Eui Sang
• Lee Yong Hee

Classifications

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0408

  for drying · CPC title

• H10P70/80 Primary

  Cleaning only by supercritical fluids · CPC title

• H10P72/0404 Primary

  for general liquid treatment, e.g. etching followed by cleaning · CPC title