Crossbar resistive memory array with highly conductive copper/copper alloy electrodes and silver/silver alloys electrodes
US-10141509-B2 · Nov 27, 2018 · US
Copper electrode material
US2021359482A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021359482-A1 |
| Application number | US-202017288403-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 6, 2020 |
| Priority date | Feb 28, 2019 |
| Publication date | Nov 18, 2021 |
| Grant date | — |
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Abstract
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A copper electrode material comprising Cu and unavoidable impurities, wherein the content of the unavoidable impurities is 1 ppm by mass or less and the average crystal grain diameter is 100 μm or less. A copper-containing electrode material having improved corrosion resistance is provided by the copper electrode material.
First claim
Opening claim text (preview).
1 . A copper electrode material, the copper electrode material comprising Cu and inevitable impurities, wherein the inevitable impurities have a content of 1 ppm by mass or less, and an average crystal grain diameter of 100 μm or less. 2 . The copper electrode material according to claim 1 , wherein the copper electrode has a S content of 0.1 ppm by mass or less, a P content of 0.1 ppm by mass or less, a Fe content of 0.1 ppm by mass or less, and an Al content of 0.1 ppm by mass or less, as contents of the inevitable impurities. 3 . The copper electrode material according to claim 1 , wherein the copper electrode material contains gas components C and O in a total amount of 5 ppm by mass or less as contents of the inevitable impurities. 4 . The copper electrode material according to claim 1 , wherein the copper electrode material has a number of pores having a pore diameter of 10 μm or more of less than 1 pore/cm2 as observed by an optical microscope. 5 . The copper electrode material according to claim 1 , wherein the copper electrode material has a number of particles (LPC) of 1000 [pieces/g] or less. 6 . The copper electrode material according to claim 1 , wherein the copper electrode material has a S content of less than 0.05 ppm by mass, a Fe content of less than 0.1 ppm by mass, a Co content of less than 0.05 ppm by mass, a Ni content of less than 0.1 ppm by mass, an As content of less than 0.005 ppm by mass, a Rh content of less than 1 ppm by mass, a Ag content of less than 1 ppm by mass, a Sn content of less than 0.5 ppm by mass, an Sb content of less than 0.005 ppm by mass, a Te content of less than 0.05 ppm by mass, a TI content of less than 3 ppm by mass, a Pb content of less than 0.05 ppm by mass, and a P content of less than 0.05 ppm by mass.
Assignees
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Classifications
- C22C9/01Primary
with aluminium as the next major constituent · CPC title
Electrodes, e.g. special shape, configuration or composition · CPC title
of copper or alloys based thereon · CPC title
mainly consisting of metals or alloys · CPC title
Alloys based on copper · CPC title
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- What does patent US2021359482A1 cover?
- A copper electrode material comprising Cu and unavoidable impurities, wherein the content of the unavoidable impurities is 1 ppm by mass or less and the average crystal grain diameter is 100 μm or less. A copper-containing electrode material having improved corrosion resistance is provided by the copper electrode material.
- Who is the assignee on this patent?
- Jx Nippon Mining & Metals Corp
- What technology area does this patent fall under?
- Primary CPC classification C22C9/01. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Nov 18 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).