Hot-rolled copper plate

Patent metadata

Field	Value
Publication number	US-9938606-B2
Application number	US-201414782177-A
Country	US
Kind code	B2
Filing date	Apr 8, 2014
Priority date	Apr 8, 2013
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

A hot-rolled copper plate consists of pure copper having a purity of 99.99 mass % or greater, the hot-rolled copper plate having an average crystal grain diameter of 40 μm or less, and a (Σ3+Σ9) grain boundary length ratio (L (σ3+σ9)/L), which is a ratio between a total crystal grain boundary length L measured by an EBSD method and a sum L (σ3+σ9) of a Σ3 grain boundary length Lσ3 and a Σ9 grain boundary length Lσ9, being 28% or greater.

First claim

What is claimed is:

1. A hot-rolled copper plate comprising:
pure copper having a purity of 99.99 mass % or greater, wherein
the hot-rolled copper plate has an average crystal grain diameter of 40 μm or less,
the hot-rolled copper plate has a (Σ3+Σ9) grain boundary length ratio (L (σ3+σ9)/L) of 28% or greater, said (Σ3+Σ9) grain boundary length ratio (L (σ3+σ9)/L) being a ratio between a total crystal grain boundary length L based on an EBSD method and a sum L (σ3+σ9) of a Σ3 grain boundary length Lσ3 and a Σ9 grain boundary length Lσ9, and
a maximum value of strength of each plane direction of an inverse pole figure based on the EBSD method is less than 5.

2. The hot-rolled copper plate according to claim 1 ,
wherein conductivity of the pure copper is 101% IACS or greater.

3. The hot-rolled copper plate according to claim 1 ,
wherein the pure copper contains 0.0003 mass % or less of Fe, 0.0002 mass % or less of O, 0.0005 mass % or less of S, and 0.0001 mass % or less of P with the balance being copper and inevitable impurities.

4. The hot-rolled copper plate according to claim 1 ,
wherein Vickers hardness is 80 or less.

5. The hot-rolled copper plate according to claim 1 ,
wherein cold rolling having a rolling reduction ratio of 10% or less, or shape correction using a leveler is performed.

6. The hot-rolled copper plate according to claim 1 , wherein the (Σ3+Σ9) grain boundary length ratio is 28% to 34.1%.

7. A sputtering target comprising:
a hot-rolled copper plate having pure copper, wherein
a purity of the pure copper is 99.99 mass % or greater,
the hot-rolled copper plate has an average crystal grain diameter of 40 μm or less,
the hot-rolled copper plate has a (Σ3+Σ9) grain boundary length ratio (L (σ3+σ9)/L) of 28% or greater, said (Σ3+Σ9) grain boundary length ratio (L (σ3+σ9)/L) being a ratio between a total crystal grain boundary length L based on an EBSD method and a sum L (σ3+σ9) of a Σ3 grain boundary length Lσ3 and a Σ9 grain boundary length Lσ9, and
a maximum value of strength of each plane direction of an inverse pole figure based on the EBSD method is less than 5.

Assignees

• Mitsubishi Materials Corp

Inventors

• Maki Kazunari
• Mori Hiroyuki
• Arai Isao
• Iida Norihisa
• Takeda Takahiro
• SHIMOIZUMI Shigeru
• Oikawa Shin

Classifications

• C22C9/00 Primary

  Alloys based on copper · CPC title

• C22F1/08

  of copper or alloys based thereon · CPC title

• C22F1/00

  Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) · CPC title

• C23C14/3414

  Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy · CPC title

• H01B1/026

  Alloys based on copper · CPC title