Dynamic thermal platform operating point for electronic devices

Patent metadata

Field	Value
Publication number	US-2016179147-A1
Application number	US-201414580036-A
Country	US
Kind code	A1
Filing date	Dec 22, 2014
Priority date	Dec 22, 2014
Publication date	Jun 23, 2016
Grant date	—

Abstract

In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.

First claim

What is claimed is:

1 . An electronic device, comprising:
a housing; at least one heat generating component disposed within the housing; at least one internal heat dissipation device positioned proximate the at least one heat generating component; and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the internal heat dissipation device and an external heat dissipation device.

2 . The electronic device of claim 1 , wherein:
the at least one heat generating device comprises at least one processor; and the at least one internal heat dissipation device comprises a heat spreader positioned proximate the processor and in thermal communication with the processor.

3 . The electronic device of claim 2 , wherein:
the thermal interface comprises an aperture formed in at least a portion of the housing proximate the heat dissipation device.

4 . The electronic device of claim 3 , wherein the aperture comprises a structured surface configured to mate with a corresponding structured surface thermally coupled to the external heat dissipation device.

5 . The electronic device of claim 4 , wherein the structured surface comprises a plurality of ribs formed from a material having a low thermal conductivity.

6 . The electronic device of claim 2 , wherein:
the thermal interface comprises a movable panel in the housing proximate the internal heat dissipation device.

7 . The electronic device of claim 6 , wherein the movable panel is movable between a first position in which the panel covers the internal heat dissipation device to a second position in which at least a portion of the internal heat dissipation device is exposed.

8 . The electronic device of claim 1 , further comprising:
a sensor to detect when the internal heat dissipation device is thermally coupled to the external heat dissipation device.

9 . The electronic device of claim 8 , further comprising:
an operating mode management unit comprising logic, at least partly including hardware logic, to:
receive a signal from the sensor indicating that the internal heat dissipation device is thermally coupled to the external heat dissipation device; and
in response to the signal, to modify a thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device.

10 . The electronic device of claim 9 , wherein the operating mode management unit further comprises logic, at least partially including hardware logic, to:
measure at least one thermal characteristic of the electronic device; and use the at least one thermal characteristic to modify the thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device.

11 . The electronic device of claim 9 , wherein the operating mode management unit further comprises logic, at least partially including hardware logic, to:
receive a signal from the sensor indicating that the internal heat dissipation device has been thermally decoupled from the external heat dissipation device; and in response to the signal, to modify a thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device.

12 . The electronic device of claim 9 , wherein the operating mode management unit further comprises logic, at least partially including hardware logic, to:
measure at least one thermal characteristic of the electronic device; and use the at least one thermal characteristic to modify the thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device.

13 . A chassis for an electronic device, comprising:
a housing; at least one internal heat dissipation device positioned in the housing; and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device.

14 . The chassis of claim 13 , wherein:
the at least one internal heat dissipation device comprises a heat spreader.

15 . The chassis of claim 14 , wherein:
the thermal interface comprises an aperture formed in at least a portion of the housing proximate the heat dissipation device.

16 . The chassis of claim 15 , wherein the aperture comprises a structured surface configured to mate with a corresponding structured surface thermally coupled to the external heat dissipation device.

17 . The chassis of claim 16 , wherein the structured surface comprises a plurality of ribs formed from a material having a low thermal conductivity.

18 . The chassis of claim 14 , wherein:
the thermal interface comprises a movable panel in the housing proximate the internal heat dissipation device.

19 . The chassis of claim 18 , wherein the movable panel is movable between a first position in which the panel covers the internal heat dissipation device to a second position in which at least a portion of the internal heat dissipation device is exposed.

20 . A controller comprising logic, at least partly including hardware logic, to:
receive a signal from a sensor indicating that an internal heat dissipation device in an electronic device is thermally coupled to an external heat dissipation device; and in response to the signal, to modify a thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device.

21 . The controller of claim 20 , further comprising logic, at least partially including hardware logic, to:
measure at least one thermal characteristic of the electronic device; and use the at least one thermal characteristic to modify the thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device.

22 . The controller of claim 20 , further comprising logic, at least partly including hardware logic, to:
receive a signal from the sensor indicating that the internal heat dissipation device has been thermally decoupled from the external heat dissipation device; and in response to the signal, to modify a thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device.

23 . The controller of claim 20 , wherein the operating mode management unit further comprises logic, at least partially including hardware logic, to:
measure at least one thermal characteristic of the electronic device; and use the at least one thermal characteristic to modify the thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device.

Assignees

• Intel Corp

Inventors

• Burr Jeremy
• Browning David W
• Mceuen Shawn S
• Macdonald Mark
• Coakley Matthew D

Classifications

• G06F1/206

  comprising thermal management · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F1/1632

  External expansion units, e.g. docking stations · CPC title