Additive manufacturing compositions and methods for the same

Patent metadata

Field	Value
Publication number	US-2021284830-A1
Application number	US-202016816126-A
Country	US
Kind code	A1
Filing date	Mar 11, 2020
Priority date	Mar 11, 2020
Publication date	Sep 16, 2021
Grant date	—

Abstract

Additive manufacturing compositions and methods for fabricating a conductive article with the same are provided. The additive manufacturing composition may include a 3D printable material, a plurality of porogens disposed in the 3D printable material, and a metal precursor disposed in the 3D printable material. The metal precursor may include a metal salt, a metal particle, or combinations thereof. The method may include forming a first layer of the article on a substrate, where the first layer includes the additive manufacturing composition, forming a second layer of the article adjacent the first layer, and binding the first layer with the second layer to fabricate the article. The method may also include plating a metal on the article to fabricate the conductive article.

First claim

What is claimed is:

1 . An additive manufacturing composition for fabricating a conductive article, comprising:
a 3D printable material; a plurality of porogens disposed in the 3D printable material; and a metal precursor disposed in the 3D printable material, wherein the metal precursor comprises a metal salt, a metal particle, or combinations thereof.

2 . The additive manufacturing composition of claim 1 , wherein the 3D printable material comprises at least one water insoluble polymer.

3 . The additive manufacturing composition of claim 1 , wherein the 3D printable material comprises one or more of acrylonitrile butadiene styrene (ABS), polylactic acid (PLA), thermoplastic polyurethane (TPU), polystyrene, polypropylene (PP), polyethylene (PE), ethylene vinyl acetate (EVA), thermoplastic polyolefin (TPO), rubber, nylon, polycaprolactone (PCL), polyethylene terephthalate (PET), polyethylene terephthalate glycol (PTG), polyamide, aromatic polyamide, polyether, polyester, polymethylmethacrylate (PMMA), polyurethane copolymers, ethylene vinyl alcohol, or combinations thereof.

4 . The additive manufacturing composition of claim 1 , wherein the porogens are soluble in an aqueous solution.

5 . The additive manufacturing composition of claim 4 , wherein the porogens comprise a water-soluble salt.

6 . The additive manufacturing composition of claim 5 , wherein the water-soluble salt comprises one or more of sodium chloride, potassium chloride, or combinations thereof.

7 . The additive manufacturing composition of claim 4 , wherein the porogens comprise a water-soluble polymer.

8 . The additive manufacturing composition of claim 7 , wherein the water-soluble polymer comprises one or more of polyvinyl pyrrolidone, polyvinyl acetate, polyethylene glycol, or combinations thereof.

9 . The additive manufacturing composition of claim 4 , wherein the porogens comprise a water-soluble carbohydrate.

10 . The additive manufacturing composition of claim 1 , wherein the metal precursor comprises the metal salt, and wherein the metal salt comprises a metal cation selected from the group consisting of a nickel cation, a zinc cation, a tin cation, a platinum cation, a copper cation, a palladium cation, a silver cation, a gold cation, an aluminum cation, an iron cation, a magnesium cation, and combinations thereof.

12 . The additive manufacturing composition of claim 1 , wherein the metal precursor comprises the metal salt, and wherein the metal salt comprises an anion selected from the group consisting of an acetylacetonate, 2-ethylhexanoate, phthalocyanine, fluoride, chloride, bromide, iodide, sulfide, nitrate, phosphate, carbonate, oxalate, formate, sulfate, triflate, bis(trifluoromethyl)sulfonimide, tetrafluoroborate, hexafluorophosphate, and combination thereof.

12 . The additive manufacturing composition of claim 1 , wherein the metal precursor comprises the metal salt, and wherein the metal salt comprises one or more of copper (II) acetylacetonate (Cu(O 2 C 5 H 7 ) 2 ), copper sulfate (CuSO 4 .5H 2 O), copper chloride, copper citrate, copper acetate, copper phosphate (Cu 3 (PO 4 ) 2 ), gold chloride (AuCl), gold bromide (AuBr), gold iodide (AuI), tetrabromoauric acid (HAuBr 4 ), palladium sulfate, (PdSO 4 .7H 2 O), palladium chloride, palladium nitrate, palladium acetate, palladium 2,4-pentanedionate, nickel sulfate, nickel chloride, silver nitrate, silver chloride, or combinations thereof.

13 . The additive manufacturing composition of claim 1 , wherein the metal precursor comprises the metal particle, and wherein the metal particle comprises one or more of copper particles, silver particles, gold particles, aluminum particles, magnesium particles, manganese particles, iron particles, nickel particles, zinc particles, tin particles, platinum particles, palladium particles, or combinations thereof.

14 . The additive manufacturing composition of claim 1 , wherein the composition consists of the 3D printable material, the porogens, and the metal precursor.

15 . The additive manufacturing composition of claim 1 , wherein the additive manufacturing composition is a 3D printable filament.

16 . The additive manufacturing composition of claim 1 , wherein the additive manufacturing composition is a 3D printable powder.

17 . The additive manufacturing composition of claim 1 , wherein the additive manufacturing composition is a curable resin.

18 . A method for fabricating a conductive article, the method comprising:
forming a first layer of an article on a substrate, the first layer comprising the additive manufacturing composition of claim 1 ; forming a second layer of the article adjacent the first layer; binding the first layer with the second layer to fabricate the article; and plating a metal on the article to fabricate the conductive article.

19 . The method of claim 18 , wherein plating the metal on the article comprises an electroless plating process.

20 . The method of claim 19 , wherein the electroless plating process comprises activating the metal precursors of the additive manufacturing composition of the first layer with a reducing agent.

21 . The method of claim 20 , wherein the electroless plating process further comprises depositing metal on or about the activated metal precursors.

22 . The method of claim 18 , further comprising removing at least a portion of the porogens of the additive manufacturing composition of the first layer with an aqueous solvent.

23 . The method of claim 18 , wherein the second layer comprises a water soluble polymer.

24 . The method of claim 18 , wherein the second layer comprises a 3D printable material substantially free of any metal precursors.

25 . The method of claim 18 , wherein the second layer comprises a plurality of porogens, and wherein the respective particle sizes of the porogens of the first layer are relatively smaller than the respective particle sizes of the porogens of the second layer.

26 . A kit for additive manufacturing of a conductive article, the kit comprising:
the additive manufacturing composition of claim 1 ; an activation solution comprising a reducing agent and configured to activate the metal precursor of the additive manufacturing composition; and a deposition solution configured to deposit metal on or about the activated metal precursor.

Assignees

• Palo Alto Res Ct Inc

Inventors

• Doris Sean Emerson
• Plochowietz Anne
• Evans Kent
• Jackson Warren
• Wei Junhua

Classifications

• C23C18/405

  Formaldehyde · CPC title

• C23C18/208

  with use of metal first · CPC title

• C23C18/1608

  from pretreatment step, i.e. selective pre-treatment · CPC title

• C23C18/1646

  Characteristics of the product obtained · CPC title

• C23C18/1641

  Organic substrates, e.g. resin, plastic · CPC title