Modeling distributed systems
US-9525599-B1 · Dec 20, 2016 · US
Organic substrates, e.g. resin, plastic
Organic substrates, e.g. resin, plastic · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1641 |
| Official title | {Organic substrates, e.g. resin, plastic} |
| Display label | Organic substrates, e.g. resin, plastic |
| Total patents | 364 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 28 |
| 2016 | 48 |
| 2017 | 41 |
| 2018 | 51 |
| 2019 | 50 |
| 2020 | 24 |
| 2021 | 33 |
| 2022 | 28 |
| 2023 | 26 |
| 2024 | 18 |
| 2025 | 15 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for forming flexible transparent conductive film
US-9506148-B2 · Nov 29, 2016 · US
Preparation of patterned or electrically-conductive articles
US-9505942-B2 · Nov 29, 2016 · US
Method for metalizing polymer substrate and polymer article prepared thereof
US-2016333481-A1 · Nov 17, 2016 · US
Method for metalizing polymer substrate and polymer article prepared thereof
US-2016326652-A1 · Nov 10, 2016 · US
Method for metalizing polymer substrate and polymer article prepared thereof
US-2016326653-A1 · Nov 10, 2016 · US
Photochemical methods and photoactive compounds for modifying surfaces
US-9454077-B2 · Sep 27, 2016 · US
Plating method
US-2016258066-A1 · Sep 8, 2016 · US
Metalized plastic articles and methods thereof
US-9435035-B2 · Sep 6, 2016 · US
Electrically-conductive proppant and methods for making and using same
US-9434875-B1 · Sep 6, 2016 · US
Counterfeit proofing of plated polymers
US-2016253586-A1 · Sep 1, 2016 · US
Electrically-Conductive Proppant and Methods for Making and Using Same
US-2016237342-A1 · Aug 18, 2016 · US
METHOD FOR FORMING CONDUCTIVE PATTERN BY DIRECT RADIATION OF ELECTROMAGNETIC WAVE, AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN THEREON (As Amended)
US-2016212860-A1 · Jul 21, 2016 · US
METHOD FOR FORMING CONDUCTIVE PATTERN BY DIRECT RADIATION OF ELECTROMAGNETIC WAVE, AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN THEREON (As Amended)
US-2016194759-A1 · Jul 7, 2016 · US
Composition for forming conductive pattern, method for forming conductive pattern using the same, and resin components having conductive pattern thereon
US-2016198569-A1 · Jul 7, 2016 · US
Resin article having plating layer and manufacturing method thereof, and conductive film
US-2016186325-A1 · Jun 30, 2016 · US
Polymer articles, ink compositions, and methods for selectively metalizing polymer articles
US-2016186322-A1 · Jun 30, 2016 · US
Resin article and method of manufacturing resin article
US-2016186324-A1 · Jun 30, 2016 · US
Coated Microcapsules
US-2016177221-A1 · Jun 23, 2016 · US
Tensile test geometry
US-2016169783-A1 · Jun 16, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1641?
- CPC C23C18/1641 is the Cooperative Patent Classification code for “Organic substrates, e.g. resin, plastic.”
- How many patents are filed under CPC C23C18/1641 (Organic substrates, e.g. resin, plastic)?
- Our database includes 364 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1641 growing?
- Publication counts under this code: 18 in 2024 vs 15 in 2025 (latest complete years).